Components And Future Of Computers

The functions of computers have evolved throughout the years. Central processing units can be used for managing servers; they can also be used as personal desktop computers in addition to notebook computers. The first generation of central processing units consisted of having a magnetic core memory, while the second generation of central processing units consisted in the arrival of transistors. After the 1960’s, the third generation of central processing units gave us an increase in the production of microprocessors.

Computer hardware engineers research, develop, and test computer systems and components such as processors, circuit boards, memory devices, and many more (Bureau of Labor Statistics). They design new computer hardware, create blueprints of computer equipment to be built. Test the completed models of the computer hardware that they design. Update existing equipment so that it will work will new software. Oversee the manufacturing process for the computer hardware. Maintain knowledge of computer engineering trends and new technology(Bureau of Labor Statistics).

Toshihiro Nakamura, manufacturing engineering section head, examined the prototype assembly process heet for the newest subnotebook computer model. When every new model was designed, considerable attention was directed toward;

“Although 3-D printers are not yet a standard part of home-computing equipment, the latest generation of devices, such as Cube® by 3D Systems, the Cubex™ or Makerbot’s Replicator™2X - which retail for between one and three thousand US dollars - are bringing the possibility of home manufacturing one step closer to reality” (Jewell). Now the biggest difference between traditional manufacturing and 3D printing will be the emergence of mass customization. Goods will be, “infinitely more customized, because altering them won’t require retooling, only tweaking the instructions in the software. Creativity in meeting individuals’ needs will come to the fore, just as quality control did in the age of rolling out sameness” (D'Aveni). When you have a product that is printed out individually from software with your own customization, then there would be no reason in buying a product that will look like something another person can own because of its ordinary accessibility. Creating physical 3D models in a fast, easy and affordable way has great potential, especially when you can do it in the comfort of your home.

Current Situation: The development of the Three Dimensional Printing Process (3DP) at MIT by researchers – Emmanuel Sachs, John Haggerty, Michael Cima, and Paul Williams – that revolutionized various businesses with its technology.

The technologies are being developed quickly and change the world 's vision. 3D printing is the innovation that will make the further breakthrough and turn the world upside down. One can print everything, starting from the plastic figures finishing with the tools, clothes, bicycles, weapon, and human body organs using the stem cells. Moreover, there are the printers that are capable of replicating itself. Three-dimensional printing transforms the computer model of the object into a really-existing one applying many thin layers that are programmed on the computer.

Nowadays, computers have incredible hardware futures, enabling problems to be resolved faster than before. According to Moore’s Law, the simplified version of this law states that processor speeds or overall processing power for computers will double every two years.

In simple words, the technology that allows you to create a 3-Dimensional object is known as 3 D printing. Now, this object can be designed by a number of processes, one of which is to add layers one on top of the other and molding the object to the shape you desire. The device used for this is commonly known as the 3D printer. The coolest thing about 3D printer is it can print another 3D printer. How cool does that sound? Technology is at its pinnacle now and with the evolution of 3D printing life is going to be much easier and fast paced. 3D printers have an advantage of modeling any size an shape objects with minimum tools. This technology evolved back in 1980’s

The most powerful computers in the technology world are the Supercomputers. Hence, as the word ‘super’ elaborate that supercomputers are usually used for the projects that needs to process large amount of data, at very high speed. Supercomputers not only has the high processing power; they are also huge in size. You need a big room to fit in a supercomputer, and a strong cooling system to avoid getting a supercomputer to get overheated. They usually have more than one CPU’s to generate high-level data processing speed, and they need to have a large storage as well. The unit system that are used to measure the computing performance of the supercomputer are ‘FLOPS’ (Floating-point Operation Per Second). The first ever supercomputer was made during the time of Second World War named “Colossus”. It was made by The Great Britain, specially to crack the coded messages of Germans. Colossus could read up to 5000 characters in a second. Colossus was the start of a revolution in supercomputing. Since 1944, more enhanced and powerful supercomputers were introduced for example MIT Whirlwind by MIT in 1950. Cray-1 designed by Seymour Cray in 1975. Seymour Cray was called the ‘Father of Supercomputer’. He founded Cray Research in 1972, which designs supercomputers. The computing power of Cray-1 was 80 megaflops (vector) and 72 megaflops (scaler). After Cray-1, Cray X-MP, and Cray-2 also came out with 4 CPU’s and twice the Floating-point Operation Per Seconds. One of the

Computer processors and graphics processors have become increasingly advanced over the past 15 years, and require a process that is able to lay billions of transistors in a short amount of time. This process starts out with a silicon wafer, which is made from sand that it is melted down and extruded into a cylinder of perfect silicon lattices. This cylinder is cut into several eighteen inch diameter disks that are close to one millimeter thick. The silicon wafer is then annealed to remove the internal stresses of the lattice and then an

Additive manufacturing (AM) methods in product development and manufacturing are projected to grow over 300% within the next 10 years

Advances in electronic design tools have validated Moore’s law (as applied to the complexity of integrated circuits) and have helped achieve amazing standards in computing power while simultaneously decreasing costs. For designers of automotive systems to duplicate and manage similar levels of complexity, design tools that automate the

3 D printing also known as additive manufacturing or stereolithography or rapid prototyping has been predominantly explored for the past few years. 3D printing technology is called additive manufacturing because the material is built from scratch, without any loss in existing volume of an object by chipping, drilling or cutting. (Tony Hoffman, 2016). The fundamental concept of additive manufacturing is printing an object by successive deposition of layers of various materials. Before an object can be 3D printed, it first has to be sliced into thousands of horizontal and vertical planes in Computer Aided Design (CAD). There are similar software like CAD which are used for the purpose of 'Slicing '. Some of these software are CAM- Computer Aided Manufacturing and 3D Scanner. These horizontal and vertical planes together make up the 3D model of the object. Once a virtual design of the object is prepared, also called as ‘the feed’, a file in the ‘.stl’ format is provided to the printer which then prints the desired object. Though the basic outcome of 3D printing is same, different technologies have been developed as per its need in the industry. Based on personal requirements, an object can be customized on small as well as large-scale.

While considering the layer format of the chips, it is also important to consider how the individual chip is manufactured. Comparing figure 1 and 2, the organization of the internal die components is a vital part of the thermal distribution in the 3D ICs. Both figures 1 and 2 show the chips at risk of overheating are those furthest from the top. While moving the dies in the IC is one way to help equalize thermal distribution, a second effective approach is to reorganize the components on the die in a more thermally favorable fashion. (Choobineh & Jain, 2014) Uniform distribution of components on the die in the IC as shown in figure 1 allows for a more evenly distribution of temperature throughout the chip. Modeling the temperature distribution of the chip is important part of the thermal management of the 3D ICs.

This manufacturing process has allowed the miniaturization of most of the devices used daily, translating to lower production costs. The typical manufacturing process involves the interconnection of the integrated circuit chips to the