Chapter 11, Problem 59SE

The bond strength when mounting an integrated circuit on a metalized glass substrate was studied as a function of factor A 5 adhesive type, factor B 5 curve time, and factor C 5 conductor material (copper and nickel). The data follows, along with an ANOVA table from Minitab. What conclusions can you draw from the data?

		Cure Time
Copper		1	2	3
		72.7	74.6	80.0
	1	80.0	77.5	82.7
		77.8	78.5	84.6
Adhesive	2	75.3	81.1	78.3
		77.3	80.9	83.9
	3	76.5	82.6	85.0
Nickel		1	2	3
		74.7	75.7	77.2
	1	77.4	78.2	74.6
		79.3	78.8	83.0
Adhesive	2	77.8	75.4	83.9
		77.2	84.5	89.4
	3	78.4	77.5	81.2

Analysis of Variance for strength
Source	DF	SS	MS	F	P
Adhesive	2	101.317	50.659	6 .54	0.007
Curetime	2	151.317	75.659	9.76	0.001
Conmater	1	0.722	0.722	0 .09	0.764
Adhes*curet	4	30.526	7.632	0 .98	0.441
Adhes*conm	2	8.015	4 .008sssss	0 .52	0.605
Curet*conm	2	5. 952	2.976	0.38	0.687
Adh*curet *conm	4	33.298	8.325	1.07	0.398
Error	18	139.515	7.751
Total	35	470.663