Chapter 29, Problem 1RQ

Define MEMS, SIMPLE, SCREAM, and HEXSIL.

To determine

Define MEMS, SIMPLE, SCREAM, and HEXSIL.

Explanation of Solution

MEMS:-

Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its most mutual form can be separate as abridged mechanical and electro-mechanical elements that are completed using the method of micro-fabrication. The acute physical dimensions of MEMS devices can differ from fine below one micron on the lesser end of the dimensional spectrum, all the way to some millimeters.

SIMPLE:-

A supplementary to SCREAM is SIMPLE (silicon micromachining by single step plasma etching), as showed. This technique uses a chlorine gas-based plasma-etching process that machines p-doped or lightly doped silicon anisotropically, but intensely n-doped silicon isotropically.

SCREAM:-

Other method for creating very deep MEMS structures is the SCREAM(single-crystal silicon reactive etching and metallization) process, depicted in. In this technique, typical lithography and etching processes form trenches 10−50 μm (400−2000 μin.) deep, which are then sheltered by a layer of chemically vapor dropped silicon oxide.

HEXSIL

This process, revealed, links hexagonal honeycomb structures, silicon micromachining, and thin-film deposition to sort high-aspect-ratio, self-supporting structures. HEXSIL can make tall structures with the definition of shape those rivals of structures made by LIGA. In HEXSIL, a deep trench is first made in single-crystal silicon by dry etching, followed by shallow wet etching to create the evener trench walls.