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[1.2] Consider the specifications for the follwing two wafers: Wafer A B Wafer radius 6 8 # of Dias 82 92 Defacts per area (defects/cm²) 0.012 0.021 Cost 9 13 a. Find the yield for both wafers. b. Find the cost per die for both wafers. c. If the number of dies per wafer is increased by 5% and the defects per area unit increases by 7%, find the die area and yield. d. Assume a fabrication process improves the yield from 0.90 to 0.97. Find the defects per area unit for each version of the technology given a die area of 100 mm².

[1.2] Consider the specifications for the follwing two wafers: Wafer A B Wafer radius 6 8 # of Dias 82 92 Defacts per area (defects/cm²) 0.012 0.021 Cost 9 13 a. Find the yield for both wafers. b. Find the cost per die for both wafers. c. If the number of dies per wafer is increased by 5% and the defects per area unit increases by 7%, find the die area and yield. d. Assume a fabrication process improves the yield from 0.90 to 0.97. Find the defects per area unit for each version of the technology given a die area of 100 mm².

Computer Networking: A Top-Down Approach (7th Edition)
Computer Networking: A Top-Down Approach (7th Edition)
7th Edition
ISBN:9780133594140
Author:James Kurose, Keith Ross
Publisher:James Kurose, Keith Ross
Chapter1: Computer Networks And The Internet
Section: Chapter Questions
Problem R1RQ: What is the difference between a host and an end system? List several different types of end...
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[1.2] Consider the specifications for the follwing two wafers: Wafer Wafer radius A B 6 8 # of Dias 82 92 Defacts per area (defects/cm²) 0.012 0.021 Cost 9 13 a. Find the yield for both wafers. b. Find the cost per die for both wafers. c. If the number of dies per wafer is increased by 5% and the defects per area unit increases by 7%, find the die area and yield. d. Assume a fabrication process improves the yield from 0.90 to 0.97. Find the defects per area unit for each version of the technology given a die area of 100 mm².
Transcribed Image Text:[1.2] Consider the specifications for the follwing two wafers: Wafer Wafer radius A B 6 8 # of Dias 82 92 Defacts per area (defects/cm²) 0.012 0.021 Cost 9 13 a. Find the yield for both wafers. b. Find the cost per die for both wafers. c. If the number of dies per wafer is increased by 5% and the defects per area unit increases by 7%, find the die area and yield. d. Assume a fabrication process improves the yield from 0.90 to 0.97. Find the defects per area unit for each version of the technology given a die area of 100 mm².
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