hin, disk-shaped silicon wafer of diameter D=20 cm on a production line must be maintained at a temperature of 100 deg C. The wafer loses heat to the room by convection and radiation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 deg C, while all surrounding surfaces (which can be treated as blackbodies) can be approximated to be isothermal at a temperature of 15 deg C. The wafer-to-air heat transfer coefficient is 30 W/m2-K and the emissivity of the wafer’s surface (which can be approximated to be gray) is 0.85. How much heat (in W) must be supplied to the wafer?

hin, disk-shaped silicon wafer of diameter D=20 cm on a production line must be maintained at a temperature of 100 deg C. The wafer loses heat to the room by convection and radiation from its upper surface, while heat is supplied at a constant flux from below. The surrounding air is at 20 deg C, while all surrounding surfaces (which can be treated as blackbodies) can be approximated to be isothermal at a temperature of 15 deg C. The wafer-to-air heat transfer coefficient is 30 W/m2-K and the emissivity of the wafer’s surface (which can be approximated to be gray) is 0.85. How much heat (in W) must be supplied to the wafer?

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter1: Basic Modes Of Heat Transfer

Section: Chapter Questions

Problem 1.30P

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