1. A 0.4-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips on one side, each dissipating 0.04 W. The board is impregnated with cop- per fillings and has an effective thermal conductivity of 30 W/m/K. All of the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to a medium at 40°C with a heat transfer coefficient of 52 W/m2/K. (a) Determine the temperatures on the two sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cm-high, and 18-cm long aluminum plate (k=237 W/m/K) with 864 2-cm-long aluminum pin fins of diameter 0.25 is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive (k=1.8 W/m/K). Determine the new temperatures on the two sides of the circuit board.
1. A 0.4-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips on one side, each dissipating 0.04 W. The board is impregnated with cop- per fillings and has an effective thermal conductivity of 30 W/m/K. All of the heat generated in the chips is conducted across the circuit board and is dissipated from the back side of the board to a medium at 40°C with a heat transfer coefficient of 52 W/m2/K. (a) Determine the temperatures on the two sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cm-high, and 18-cm long aluminum plate (k=237 W/m/K) with 864 2-cm-long aluminum pin fins of diameter 0.25 is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive (k=1.8 W/m/K). Determine the new temperatures on the two sides of the circuit board.
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter3: Transient Heat Conduction
Section: Chapter Questions
Problem 3.15P: A thin-wall jacketed tank heated by condensing steam at one atmosphere contains 91 kg of agitated...
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