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1718 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently the IC chip is packaged into an electronic device as shown in Figure 17.5. The base of the chip is in contact with an inert aluminum plate that is 0.3-cm thick. The IC chip and its aluminum base are mounted within a thermally insulating ceramic material, which you may be assumed to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat-transfer coefficient of 100 W/m².K. The ambient air temperature (T) is maintained at 30 C. The chip is operated for a sufficient time that steady-state opera- tion can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is KIC 1 W/m - K, and the thermal conductivity of aluminum is KAI = 230 W/m. K. = a. What is the surface temperature, T₁, of the IC chip exposed to the air? b. What is the temperature, T2, of the IC chip package at the base of the IC chip (x = L₁) resting on top of the aluminum plate? air flow h = 100 W/m²-K T∞ = 30 C IC Chip, Kic=1.0 W/m-K Aluminum insulated boundary 4.0 cm -x=0, T = T₁ x= L₁ = 0.5 cm, T = T₂ = x = L₂, T = T3 i D I S IC chip imbedded in insulated boundary.

1718 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently the IC chip is packaged into an electronic device as shown in Figure 17.5. The base of the chip is in contact with an inert aluminum plate that is 0.3-cm thick. The IC chip and its aluminum base are mounted within a thermally insulating ceramic material, which you may be assumed to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat-transfer coefficient of 100 W/m².K. The ambient air temperature (T) is maintained at 30 C. The chip is operated for a sufficient time that steady-state opera- tion can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is KIC 1 W/m - K, and the thermal conductivity of aluminum is KAI = 230 W/m. K. = a. What is the surface temperature, T₁, of the IC chip exposed to the air? b. What is the temperature, T2, of the IC chip package at the base of the IC chip (x = L₁) resting on top of the aluminum plate? air flow h = 100 W/m²-K T∞ = 30 C IC Chip, Kic=1.0 W/m-K Aluminum insulated boundary 4.0 cm -x=0, T = T₁ x= L₁ = 0.5 cm, T = T₂ = x = L₂, T = T3 i D I S IC chip imbedded in insulated boundary.

Introduction to Chemical Engineering Thermodynamics
Introduction to Chemical Engineering Thermodynamics
8th Edition
ISBN:9781259696527
Author:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Publisher:J.M. Smith Termodinamica en ingenieria quimica, Hendrick C Van Ness, Michael Abbott, Mark Swihart
Chapter1: Introduction
Section: Chapter Questions
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Q17.18

be taken as 5 Btu/h ft² F. 17.17 Saturated steam at 40 psia flows at 5 fps through a schedule-40, 12-in steel pipe. The convective heat-transfer coefficient by condensing steam on the inside surface may be taken as 1500 Btu/h ft2 F. The surrounding air is at 80 F, and the outside surface coefficient is 3 Btu/ft2 F. Determine the following: a. The heat loss per 10 ft of bare pipe. b. The heat loss per 10 ft of pipe insulated with 2 in of 85% magnesia. C. The mass of steam condensed in 10 ft of bare pipe. 1718 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently the IC chip is packaged into an electronic device as shown in Figure 17.5. The base of the chip is in contact with an inert aluminum plate that is 0.3-cm thick. The IC chip and its aluminum base are mounted within a thermally insulating ceramic material, which you may be assumed to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat-transfer coefficient of 100 W/m² K. The ambient air temperature (T) is maintained at 30 C. The chip is operated for a sufficient time that steady-state opera- tion can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is kic = 1 W/m K, and the thermal conductivity of aluminum is KAI = 230 W/m. K. a. What is the surface temperature, T₁, of the IC chip exposed to the air? b. What is the temperature, T2, of the IC chip package at the base of the IC chip (x = L₁) resting on top of the aluminum plate? air flow h = 100 W/m²-K may IC Chip, Kic= 1.0 W/m-K Aluminum T∞ = 30 C insulated boundary 4.0 cm IC chip imbedded in insulated boundary. proc of th 17.19 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently, the IC chip is packaged into an electronic device as shown. The IC chip is mounted within a a. b. C. 17/20 with a x = 0, T = T₁ 0.14 B x = L₁ = 0.5 cm, T = T₂ at 70 I X = L₂, T = T3 insulat resistiv 17.21 surroun convec and the d. temper 17.22 copper.
Transcribed Image Text:be taken as 5 Btu/h ft² F. 17.17 Saturated steam at 40 psia flows at 5 fps through a schedule-40, 12-in steel pipe. The convective heat-transfer coefficient by condensing steam on the inside surface may be taken as 1500 Btu/h ft2 F. The surrounding air is at 80 F, and the outside surface coefficient is 3 Btu/ft2 F. Determine the following: a. The heat loss per 10 ft of bare pipe. b. The heat loss per 10 ft of pipe insulated with 2 in of 85% magnesia. C. The mass of steam condensed in 10 ft of bare pipe. 1718 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently the IC chip is packaged into an electronic device as shown in Figure 17.5. The base of the chip is in contact with an inert aluminum plate that is 0.3-cm thick. The IC chip and its aluminum base are mounted within a thermally insulating ceramic material, which you may be assumed to act as a perfect thermal insulator. The top side of the IC chip is exposed to air, which provides a convective heat-transfer coefficient of 100 W/m² K. The ambient air temperature (T) is maintained at 30 C. The chip is operated for a sufficient time that steady-state opera- tion can be assumed. Within the process temperature range of interest, the thermal conductivity of the IC chip material is kic = 1 W/m K, and the thermal conductivity of aluminum is KAI = 230 W/m. K. a. What is the surface temperature, T₁, of the IC chip exposed to the air? b. What is the temperature, T2, of the IC chip package at the base of the IC chip (x = L₁) resting on top of the aluminum plate? air flow h = 100 W/m²-K may IC Chip, Kic= 1.0 W/m-K Aluminum T∞ = 30 C insulated boundary 4.0 cm IC chip imbedded in insulated boundary. proc of th 17.19 A computer IC chip consumes 10 W of power, which is dissipated as heat. The chip measures 4 cm by 4 cm on a side and is 0.5-cm thick. Currently, the IC chip is packaged into an electronic device as shown. The IC chip is mounted within a a. b. C. 17/20 with a x = 0, T = T₁ 0.14 B x = L₁ = 0.5 cm, T = T₂ at 70 I X = L₂, T = T3 insulat resistiv 17.21 surroun convec and the d. temper 17.22 copper.
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