A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 25 deg C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 25 deg C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter2: Steady Heat Conduction
Section: Chapter Questions
Problem 2.1P: A plane wall, 7.5 cm thick, generates heat internally at the rate of 105 W/m3. One side of the wall...
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A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 25 deg C, where the convective heat transfer coefficient of air flow is 100 W/(m2 K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
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