A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m² K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at 250C, where the convective heat transfer coefficient of air flow is 100 W/(m² K). If the heat dissipation per unit area from the chip is 104 W/m2 under steady state condition, draw the thermal circuit for the system and determine the operating temperature of the chip.
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter1: Basic Modes Of Heat Transfer
Section: Chapter Questions
Problem 1.45P: An electronic device that internally generates 600 mW of heat has a maximum permissible operating...
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