As a process engineer, you are required to deposit conformal silicon thin films with 500 nm thickness on a textured glass substrate (see Figure 1 below) using thermal evaporation and chemical vapour deposition processes. Explain the details of both processes. Contrast the properties of the silicon thin films fabricated by both processes. 500 nm silicon thin film Textured glass Figure 1. Silicon thin film on textured glass.

As a process engineer, you are required to deposit conformal silicon thin films with 500 nm thickness on a textured glass substrate (see Figure 1 below) using thermal evaporation and chemical vapour deposition processes. Explain the details of both processes. Contrast the properties of the silicon thin films fabricated by both processes. 500 nm silicon thin film Textured glass Figure 1. Silicon thin film on textured glass.

Understanding Motor Controls

4th Edition

ISBN:9781337798686

Author:Stephen L. Herman

Publisher:Stephen L. Herman

Chapter44: Semiconductors

Section: Chapter Questions

Problem 3RQ: The two materials most often used to produce semiconductor devices are ____________ and...

See similar textbooks

Similar questions

Consider a 2-mm-thick silicon (Si) wafer to be doped using antimony (Sb). Assume that the dopant source (gas mixture of antimony chloride and other gases) provides a constant concentration of 1022 atoms/m3. We need a dopant profile such that the concentration of Sb at a depth of 1 micrometer is 5 x 1021 atoms/m3. What is the required time for the diffusion heat treatment? Assume that the silicon wafer initially contains no impurities or dopants. Assume that the activation energy for diffusion of Sb in silicon is 380 kJ/mole and D0 for Sb diffusion in Si is 1.3 x 10-3 m2/s. Assume T = 1250°C.
Nylon 6,6 is a thermoplastic polymer with high mechanical strength, high resistance to chemical environments, and good stability under heat. Therefore, it is well suited to be used in 3D structural objects. A cylindrical nylon 6,6 pipe is made by injection molding. The pipe is 1 m long with an outer diameter of 8cm, and a thickness of 2mm. The crystallinity of the pipe is 25%. The density and associated percent crystallinity for two nylon 6,6 samples are measured as below: ρ(g/cm3) crystallinity (%) 1.190 67 1.155 44 If the degree of polymerization is 500, calculate the number of chains in the pipe. (Assume the chains are equal in length).
Nylon 6,6 is a thermoplastic polymer with high mechanical strength, high resistance to chemical environments, and good stability under heat. Therefore, it is well suited to be used in 3D structural objects. A cylindrical nylon 6,6 pipe is made by injection molding. The pipe is 1 m long with an outer diameter of 8cm, and a thickness of 2mm. The crystallinity of the pipe is 25%. The density and associated percent crystallinity for two nylon 6,6 samples are measured as below: ρ(g/cm3) crystallinity (%) 1.190 67 1.155 44 Calculate the density of this pipe, which has 25% crystallinity.
P3 Examine the properties and applications of ceramic products manufactured using the sintering, hot pressing, chemical vapour deposition (CVD) and, reaction bonding processes.
A coating process using suspended particles in a liquid can attain formation of an ultrafiltration ceramic top-layer on a porous support (substrate). Which type of coating mechanisms is most probable? What is the effect of the coating time on the thickness of the coated layer? What is the effect of the pulling rate out of the liquid on the thickness of the coated layer?
Explain , why you would/would not use XRD for the characterization of glass
In a viscoelastic material, why does tan delta peak at the glass transition temperature?
Using the table below, estimate the components of the matrices and develop the stiffness and compliance matrices for an orthotropic lamina of E-glass/470-36 E-glass/vinylester.
Illustrate the difference between crystalline structure and amorphous structure using an example
Derive the temperature trend in a multilayer material made of 2 slabs alluminum (λ1 and λ2) with air between them (h).
Why is atomic diffusion called a thermal activation process? What does the thermal activation energy represent? How does the diffusion rate depend on temperature?
The two materials most often used to produce semiconductor devices are ____________ and ____________.