Consider the cooling system for the back of an integrated circuit. The chip has dimension 10 cmx 21 cm, and has 6 evenly spaced fins of length 2cm and thickness 1cm running along the long side of the chip. The base of the cooling back is 150o The fins are made of aluminum. It is exposed to ambient air at 20oC with a convective heat transfer coefficient 25W/m2K. Use the approximation to change a convective tip to an adiabatic tip. Heat transfer from the fin. Individual fin effectiveness. Overall fin effectiveness.

Consider the cooling system for the back of an integrated circuit. The chip has dimension 10 cmx 21 cm, and has 6 evenly spaced fins of length 2cm and thickness 1cm running along the long side of the chip. The base of the cooling back is 150o The fins are made of aluminum. It is exposed to ambient air at 20oC with a convective heat transfer coefficient 25W/m2K. Use the approximation to change a convective tip to an adiabatic tip. Heat transfer from the fin. Individual fin effectiveness. Overall fin effectiveness.

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter3: Transient Heat Conduction

Section: Chapter Questions

Problem 3.29P: A mild-steel cylindrical billet 25 cm in diameter is to be raised to a minimum temperature of 760C...

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