Forced air at T∞ = 25°C and V = 12 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm × 4 mm, located 153 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nu_x=0.04Re_x^{0.85}\Pr^{\frac{1}{3}}Nux=0.04Rex0.85Pr31 Estimate the surface temperature of the chip if it is dissipating 32 mW.
Forced air at T∞ = 25°C and V = 12 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm × 4 mm, located 153 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nu_x=0.04Re_x^{0.85}\Pr^{\frac{1}{3}}Nux=0.04Rex0.85Pr31 Estimate the surface temperature of the chip if it is dissipating 32 mW.
Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter5: Analysis Of Convection Heat Transfer
Section: Chapter Questions
Problem 5.31P
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Forced air at T∞ = 25°C and V = 12 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm × 4 mm, located 153 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form
Nu_x=0.04Re_x^{0.85}\Pr^{\frac{1}{3}}Nux=0.04Rex0.85Pr31
Estimate the surface temperature of the chip if it is dissipating 32 mW.
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