hermal conductivity of the layers and temperatures are shown conduction, answer the following questions. 1. What are the main assumptions? 2. Drive an equation to calculate the heat transfer rate throu 3. Draw the thermal circuit through composite wall? 4. What are the value Ti?

hermal conductivity of the layers and temperatures are shown conduction, answer the following questions. 1. What are the main assumptions? 2. Drive an equation to calculate the heat transfer rate throu 3. Draw the thermal circuit through composite wall? 4. What are the value Ti?

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter1: Basic Modes Of Heat Transfer

Section: Chapter Questions

Problem 1.44P: A composite refrigerator wall is composed of 5 cm of corkboard sandwiched between a 1.2-cm-thick...

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1.37 Mild steel nails were driven through a solid wood wall consisting of two layers, each 2.5-cm thick, for reinforcement. If the total cross-sectional area of the nails is 0.5% of the wall area, determine the unit thermal conductance of the composite wall and the percent of the total heat flow that passes through the nails when the temperature difference across the wall is 25°C. Neglect contact resistance between the wood layers.
One end of a 0.3-m-long steel rod is connected to a wall at 204C. The other end is connected to a wall that is maintained at 93C. Air is blown across the rod so that a heat transfer coefficient of 17W/m2 K is maintained over the entire surface. If the diameter of the rod is 5 cm and the temperature of the air is 38C, what is the net rate of heat loss to the air?
1.4 To measure thermal conductivity, two similar 1-cm-thick specimens are placed in the apparatus shown in the accompanying sketch. Electric current is supplied to the guard heater, and a wattmeter shows that the power dissipation is 10 W. Thermocouples attached to the warmer and to the cooler surfaces show temperatures of 322 and 300 K, respectively. Calculate the thermal conductivity of the material at the mean temperature in W/m K. Problem 1.4
1.63 Liquid oxygen (LOX) for the space shuttle is stored at 90 K prior to launch in a spherical container 4 m in diameter. To reduce the loss of oxygen, the sphere is insulated with superinsulation developed at the U.S. National Institute of Standards and Technology's Cryogenic Division; the superinsulation has an effective thermal conductivity of 0.00012 W/m K. If the outside temperature is on the average and the LOX has a heat of vaporization of 213 J/g, calculate the thickness of insulation required to keep the LOX evaporation rate below 200 g/h.
1.10 A heat flux meter at the outer (cold) wall of a concrete building indicates that the heat loss through a wall of 10-cm thickness is . If a thermocouple at the inner surface of the wall indicates a temperature of 22°C while another at the outer surface shows 6°C, calculate the thermal conductivity of the concrete and compare your result with the value in Appendix 2, Table 11.
A section of a composite wall with the dimensions shown below has uniform temperatures of 200C and 50C over the left and right surfaces, respectively. If the thermal conductivities of the wall materials are: kA=70W/mK,kB=60W/mK, kC=40W/mK, and kD=20W/mK, determine the rate of heat transfer through this section of the wall and the temperatures at the interfaces.
A section of a composite wall with the dimensions shown below has uniform temperatures of 200C and 50C over the left and right surfaces, respectively. If the thermal conductivities of the wall materials are: kA=70W/mK,kB=60W/mK, kC=40W/mK, and kP=20W/mK, determine the rate of heat transfer through this section of the wall and the temperatures at the interfaces. Repeat Problem 1.34, including a contact resistance of 0.1 K/W at each of the interfaces.
Both ends of a 0.6-cm copper U-shaped rod are rigidly affixed to a vertical wall as shown in the accompanying sketch. The temperature of the wall is maintained at 93C. The developed length of the rod is 0.6 m, and it is exposed to air at 38C. The combined radiation and convection heat transfer coefficient for this system is 34W/m2K. (a) Calculate the temperature of the midpoint of the rod. (b) What will the rate of heat transfer from the rod be?
A composite refrigerator wall is composed of 5 cm of corkboard sandwiched between a 1.2-cm-thick layer of oak and a 0.8-mm-thick layer of aluminum lining on the inner surface. The average convection heat transfer coefficients at the interior and exterior wall are 11 and 8.5W/(m2K) respectively. (a) Draw the thermal circuit. (b) Calculate the individual resistances of the components of this composite wall and the resistances at the surfaces. (c) Calculate the overall heat transfer coefficient through the wall. (d) For an air temperature of 1C inside the refrigerator and 32C outside, calculate the rate of heat transfer per unit area through the wall.
2.30 An electrical heater capable of generating 10,000 W is to be designed. The heating element is to be a stainless steel wire having an electrical resistivity of ohm-centimeter. The operating temperature of the stainless steel is to be no more than 1260°C. The heat transfer coefficient at the outer surface is expected to be no less than in a medium whose maximum temperature is 93°C. A transformer capable of delivering current at 9 and 12 V is available. Determine a suitable size for the wire, the current required, and discuss what effect a reduction in the heat transfer coefficient would have. (Hint: Demonstrate first that the temperature drop between the center and the surface of the wire is independent of the wire diameter, and determine its value.)
A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 W/m K. Problem 1.6
A hollow sphere with inner and outer radii of R1 and R2, respectively, is covered with a layer of insulation having an outer radius of R3. Derive an expression for the rate of heat transfer through the insulated sphere in terms of the radii, the thermal conductivities, the heat transfer coefficients, and the temperatures of the interior and the surrounding medium of the sphere.