materials are cross- linked but they have a low cross linked density.
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- 1. Component of materials science and engineering that shows the way a material responds to the environment and external forces. 2. They are electrons that occupy the outermost shell in an atom, and are responsible in forming bonds.Discuss the effect of temperature change on interatomic bonds in terms of the type of material. Evaluate the effects of the differences on the thermal analysis data.Briefly state how the weak bonds form and explain their effects on the mechanical properties of materials.
- Chemistry Consider FCC copper. If bond energy per atom is 5.62 × 10-19 J, and its atomic radius is 0.128 nm, the surface energy for (100) plane will beOn the bond-force curve below, indicate the equilibrium distance between two atoms.Increasing the temperature of a semiconductor breaks covalent bonds. For each broken bond, two electrons become free to move and transfer electrical charge. What fraction of the total valance electrons are free to move and what fraction of the covalent bonds must be broken in order that 5×1015 electrons conduct electrical charge in 50 g of silicon?
- Which type of bonding between atoms is characterized by the sharing of electrons between two or more atoms? Covalent Ionic Metallic Van Der Waals Please answer the question in the image (explantion not needed)Materials that block the movement of dislocations are:For APF, Which one of the following is the assumption a. The atoms overlap b. The atoms are rigid cubes c. The atoms do not overlap d. The atoms are not rigid spheres