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Principles Of Heat Transfer 8th edition, Problem 1.67chapter 1.
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- 3.38 An egg, which for the purposes of this problem is assumed to be a 5-cm-diameter sphere having the thermal properties of water, is initially at a temperature of . It is immersed in boiling water at for 15 min. The heat transfer coefficient from the water to the egg is assumed to be . What is the temperature of the egg center at the end of the cooking period?1.63 Liquid oxygen (LOX) for the space shuttle is stored at 90 K prior to launch in a spherical container 4 m in diameter. To reduce the loss of oxygen, the sphere is insulated with superinsulation developed at the U.S. National Institute of Standards and Technology's Cryogenic Division; the superinsulation has an effective thermal conductivity of 0.00012 W/m K. If the outside temperature is on the average and the LOX has a heat of vaporization of 213 J/g, calculate the thickness of insulation required to keep the LOX evaporation rate below 200 g/h.1.4 To measure thermal conductivity, two similar 1-cm-thick specimens are placed in the apparatus shown in the accompanying sketch. Electric current is supplied to the guard heater, and a wattmeter shows that the power dissipation is 10 W. Thermocouples attached to the warmer and to the cooler surfaces show temperatures of 322 and 300 K, respectively. Calculate the thermal conductivity of the material at the mean temperature in W/m K. Problem 1.4
- The handle of a ladle used for pouring molten lead is 30 cm long. Originally the handle was made of 1.9cm1.25cm mild steel bar stock. To reduce the grip temperature, it is proposed to form the handle of tubing 0.15 cm thick to the same rectangular shape. If the average heat transfer coefficient over the handle surface is 14 W/m K, estimate the reduction of the temperature at the grip in air at 21C.A 0.6-cm diameter mild steel rod at 38C is suddenly immersed in a liquid at 93C with hc=110W/m2K. Determine the time required for the rod to warm to 88C.A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 W/m K. Problem 1.6
- 5.10 Experiments have been performed on the temperature distribution in a homogeneous long cylinder (0.1 m diameter, thermal conductivity of 0.2 W/m K) with uniform internal heat generation. By dimensional analysis, determine the relation between the steady-state temperature at the center of the cylinder , the diameter, the thermal conductivity, and the rate of heat generation. Take the temperature at the surface as your datum. What is the equation for the center temperature if the difference between center and surface temperature is when the heat generation is ?Both ends of a 0.6-cm copper U-shaped rod are rigidly affixed to a vertical wall as shown in the accompanying sketch. The temperature of the wall is maintained at 93C. The developed length of the rod is 0.6 m, and it is exposed to air at 38C. The combined radiation and convection heat transfer coefficient for this system is 34W/m2K. (a) Calculate the temperature of the midpoint of the rod. (b) What will the rate of heat transfer from the rod be?