A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is coole by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate th W mK steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 Silicon chip Synthetic liquid Substrate

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)
8th Edition
ISBN:9781305387102
Author:Kreith, Frank; Manglik, Raj M.
Publisher:Kreith, Frank; Manglik, Raj M.
Chapter1: Basic Modes Of Heat Transfer
Section: Chapter Questions
Problem 1.6P: A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in...
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A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled
by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the
W
steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150
Silicon chip
Synthetic liquid
Substrate
Transcribed Image Text:A square silicon chip 7 mm x 7 mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the W steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 Silicon chip Synthetic liquid Substrate
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