Consider a 6-in * 8-in epoxy glass laminate (k = 0.10 Btu/h·ft·°F) whose thickness is 0.05 in. In order to reduce the thermal resistance across its thickness, cylindrical copper fillings (k = 223 Btu/h·ft·°F) of 0.02 in diameter are to be planted throughout the board, with a center-to-center distance of 0.06 in. Determine the new value of the thermal resistance of the epoxy board for heat conduction across its thickness as a result of this modification.

Principles of Physics: A Calculus-Based Text
5th Edition
ISBN:9781133104261
Author:Raymond A. Serway, John W. Jewett
Publisher:Raymond A. Serway, John W. Jewett
Chapter16: Temperature And The Kinetic Theory Of Gases
Section: Chapter Questions
Problem 12P
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Consider a 6-in * 8-in epoxy glass laminate (k =
0.10 Btu/h·ft·°F) whose thickness is 0.05 in. In order to
reduce the thermal resistance across its thickness, cylindrical
copper fillings (k = 223 Btu/h·ft·°F) of 0.02 in diameter
are to be planted throughout the board, with a center-to-center
distance of 0.06 in. Determine the new value of the thermal
resistance of the epoxy board for heat conduction across its thickness as a result of this modification.

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