Consider the heat equation dtu = əx2u with solutions defined on 0 s x s 1 and boundary conditions uº(0) = 0,u(1) = 0. Find explicit solutions of the form u(t,x) = v(t)w(x) satisfying the initial condition u(x, t = 0) = COS
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- A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 W/m K. Problem 1.63.10 A spherical shell satellite (3-m-OD, 1.25-cm-thick stainless steel walls) re-enters the atmosphere from outer space. If its original temperature is 38°C, the effective average temperature of the atmosphere is 1093°C, and the effective heat transfer coefficient is , estimate the temperature of the shell after reentry, assuming the time of reentry is 10 min and the interior of the shell is evacuated.Estimate the rate of heat loss per unit length from a 5-cm ID, 6-cm OD steel pipe covered with high-temperature insulation having a thermal conductivity of 0.11 W/(m K) and a thickness of 1.2 cm. Steam flows in the pipe. It has a quality of 99% and is at 150C. The unit thermal resistance at the inner wall is 0.0026(m2K)/W the heat transfer coefficient at the outer surface is 17W/(m2K) and the ambient temperature is 16C.
- 2.7 A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at , where the convective heat transfer coefficient of air flow is . If the heat dissipation per unit area from the chip is under steady-state conditions, draw the thermal circuit for the system and determine the operating temperature of the chip.Derive an expression for the temperature distribution in an infinitely long rod of uniform cross section within which there is uniform heat generation at the rate of 1 W/m. Assume that the rod is attached to a surface at Ts and is exposed through a convection heat transfer coefficient h to a fluid at Tf.A fluid has a temperature of 100C and thermal film coefficient of 50 W/m^2-K. Solve for the heat transferred per sq m of contact if the surface it is in contact with has a surface temperature of 20C.
- Fluid fluid with a temperature of -20C passes through a copper cylindrical wire. The outer diameter of the wire is 10 mm. The wire is in contact with air at a temperature of 25C, which is h = 50 W / m2K. The heat conduction coefficient of the wire is k = 0.5 W / mK. It will be applied in different thicknesses. a) Calculation separately for the resulting heat transfer per m when 0, 2.5, 5 and 7.5 m are applied. b) To interpret which thickness will increase the heat transfer by calculating the critical diameter. c) Graph the insulation and heat transfer rate against each other.Calculate the heat flow per square meter (heat flux) through water medium with thermal conductivity of 0.6, flowing in a 5 cm thickness space, if the temperatures on the two surfaces are 50 and 210°C, respectively.Radial aluminum blades are added to a small compressor as shown in the figure. There is a heat transfer rate of 1 kW between the vane compressor and the surrounding air at 20 C. Each blade is 100 mm long, 30 mm high and 5 mm thick. Calculate the required number of blades so that the temperature at the place where the blade is attached to the surface does not exceed 120C, with the task that h = 15 W / m2K for the perimeter.
- Derive the combined one-dimensional heat conduction equation.Provide two sample question regarding Heat transfer between two fluids separated by walls of a composite tube of solid materialsA spherical shaped vessel of 1.4 m diameter is 90 mm thick. Find the rate of heat leakage, if the temperature difference between the inner and outer surfaces is 220oC. Thermal conductivity of the material of the sphere is 0.083 W/m-K.