Diamond blade- 0.75 mm thickness Si boule - 300 mm diameter Cut wafers 2 m

Chemistry: Matter and Change
1st Edition
ISBN:9780078746376
Author:Dinah Zike, Laurel Dingrando, Nicholas Hainen, Cheryl Wistrom
Publisher:Dinah Zike, Laurel Dingrando, Nicholas Hainen, Cheryl Wistrom
Chapter2: Analyzing Data
Section2.3: Uncertainty In Data
Problem 40PP
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Silicon for computer chips is grown in large cylinders called
“boules” that are 300 mm in diameter and 2 m in length, as
shown. The density of silicon is 2.33 g/cm3. Silicon wafers
for making integrated circuits are sliced from a 2.0-m boule
and are typically 0.75 mm thick and 300 mm in diameter.
(a) How many wafers can be cut from a single boule?
(b) What is the mass of a silicon wafer? (The volume of a cylinder
is given by πr2h, where r is the radius and h is its height.)

Diamond blade-
0.75 mm
thickness
Si boule
- 300 mm
diameter
Cut wafers
2 m
Transcribed Image Text:Diamond blade- 0.75 mm thickness Si boule - 300 mm diameter Cut wafers 2 m
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