In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12x10-4 m thick. (a) Assuming no waste, how many wafers can be made? (b) What is the mass of a wafer (d of Si = 2.34 g/cm3; V of a cylinder = πr2h)? (c) A key step in making π-n junctions for the chip is chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction. (d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?
In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12x10-4 m thick. (a) Assuming no waste, how many wafers can be made? (b) What is the mass of a wafer (d of Si = 2.34 g/cm3; V of a cylinder = πr2h)? (c) A key step in making π-n junctions for the chip is chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction. (d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?
General Chemistry - Standalone book (MindTap Course List)
11th Edition
ISBN:9781305580343
Author:Steven D. Gammon, Ebbing, Darrell Ebbing, Steven D., Darrell; Gammon, Darrell Ebbing; Steven D. Gammon, Darrell D.; Gammon, Ebbing; Steven D. Gammon; Darrell
Publisher:Steven D. Gammon, Ebbing, Darrell Ebbing, Steven D., Darrell; Gammon, Darrell Ebbing; Steven D. Gammon, Darrell D.; Gammon, Ebbing; Steven D. Gammon; Darrell
Chapter6: Thermochemisty
Section: Chapter Questions
Problem 6.94QP
Related questions
Question
In making computer chips, a 4.00-kg cylindrical ingot of ultrapure n-type doped silicon that is 5.20 inches in diameter is sliced into wafers 1.12x10-4 m thick. (a) Assuming no waste, how many wafers can be made? (b) What is the mass of a wafer (d of Si = 2.34 g/cm3; V of a cylinder = πr2h)? (c) A key step in making π-n junctions for the chip is chemical removal of the oxide layer on the wafer through treatment with gaseous HF. Write a balanced equation for this reaction. (d) If 0.750% of the Si atoms are removed during the treatment in part (c), how many moles of HF are required per wafer, assuming 100% reaction yield?
Expert Solution
This question has been solved!
Explore an expertly crafted, step-by-step solution for a thorough understanding of key concepts.
Step by step
Solved in 7 steps
Knowledge Booster
Learn more about
Need a deep-dive on the concept behind this application? Look no further. Learn more about this topic, chemistry and related others by exploring similar questions and additional content below.Recommended textbooks for you
General Chemistry - Standalone book (MindTap Cour…
Chemistry
ISBN:
9781305580343
Author:
Steven D. Gammon, Ebbing, Darrell Ebbing, Steven D., Darrell; Gammon, Darrell Ebbing; Steven D. Gammon, Darrell D.; Gammon, Ebbing; Steven D. Gammon; Darrell
Publisher:
Cengage Learning
Chemistry: The Molecular Science
Chemistry
ISBN:
9781285199047
Author:
John W. Moore, Conrad L. Stanitski
Publisher:
Cengage Learning
General Chemistry - Standalone book (MindTap Cour…
Chemistry
ISBN:
9781305580343
Author:
Steven D. Gammon, Ebbing, Darrell Ebbing, Steven D., Darrell; Gammon, Darrell Ebbing; Steven D. Gammon, Darrell D.; Gammon, Ebbing; Steven D. Gammon; Darrell
Publisher:
Cengage Learning
Chemistry: The Molecular Science
Chemistry
ISBN:
9781285199047
Author:
John W. Moore, Conrad L. Stanitski
Publisher:
Cengage Learning