the manager asked you to prepare a poster as a training material. the audience is a fresh engineers and senior technicians. he requested you to pick one of the special processing and assembly technologies: one of microfabrication technologies. the document should cover the following: fundamentals. technologies (types). applications.

the manager asked you to prepare a poster as a training material. the audience is a fresh engineers and senior technicians. he requested you to pick one of the special processing and assembly technologies: one of microfabrication technologies. the document should cover the following: fundamentals. technologies (types). applications.

An Introduction to Physical Science

14th Edition

ISBN:9781305079137

Author:James Shipman, Jerry D. Wilson, Charles A. Higgins, Omar Torres

Publisher:James Shipman, Jerry D. Wilson, Charles A. Higgins, Omar Torres

Chapter12: Chemical Bonding

Section: Chapter Questions

Problem 3AYK

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You are using a thin layer of epoxy to bond a Silicon chip to a pure aluminum plate that acts as a heat sink (epoxy layer 0.0200mm). The Silicon chip (k = 149.0 W/(m-K) is 0.200 mm thick, and has dimensions of 25.0mm by 25.0mm. The pure aluminum plate is 0.850cm thick, and has the same dimensions as the Silicon chip. The hot side of the silicon chip is measured to be 62.0°C; the cold side of the pure aluminum plate is measured to be 31.0°C. Assuming steady-state conduction (with the thin layer of epoxy acting as contact resistance, see Table 3.2.) determine the heat transfer rate through the chip. Do not add in an addition resistance due to the thickness of the epoxy layer, this has been incorporated into the contact resistance.
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