The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2024 and 0.2158 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.) (b) Determine the mean of X. (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X. (Round your answer to 8 decimal places.) micrometers2

College Algebra
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ISBN:9781337282291
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Chapter5: Exponential And Logarithmic Functions
Section5.5: Exponential And Logarithmic Models
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The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly
distributed between 0.2024 and 0.2158 micrometers.
(a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal
places.)
(b) Determine the mean of X. (Round your answer to 4 decimal places.)
micrometers
(c) Determine the variance of X. (Round your answer to 8 decimal places.)
micrometers?
Transcribed Image Text:The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2024 and 0.2158 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.) (b) Determine the mean of X. (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X. (Round your answer to 8 decimal places.) micrometers?
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