The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformlydistributed between 0.2047 and 0.2153 micrometers.(a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimalplaces.)D(b) Determine the mean of X. (Round your answer to 4 decimal places.)imicrometers(c) Determine the variance of X. (Round your answer to 8 decimal places.)micrometers²The thickness of a flange on an aircraft component is uniformly distributed between 0.95 and 1.05 millimeters.(a) Determine the proportion of flanges that exceeds 0.98 millimeters.0.7(b) What thickness is exceeded by 90% of the flanges?0.96millimeters(c) Determine the mean and variance of flange thickness.Mean 1millimetersVariance-0.000833millimeters (Round your answer to 6 decimal places)Statistical Tables an

We have to find the mean and variance. According to our guidelines we can solve only one question…

The thickness of photoresist applied to wafers in semiconductor manufacturing at a particular location on the wafer is uniformly distributed between 0.2047 and 0.2153 micrometers. (a) Determine the proportion of wafers that exceeds 0.2125 micrometers of photoresist thickness. (Round your answer to 3 decimal places.) (b) Determine the mean of X (Round your answer to 4 decimal places.) micrometers (c) Determine the variance of X (Round your answer to 8 decimal places) i micrometers2