Explain the difference between brazing and soldering.

The difference between soldering and brazing

Soldering: Soldering is a joining method which is used to join similar or dissimilar metals with the help of some filler material. The liquidus temperature of this filler material should be less than 427^o Celsius. The features which make the soldering different from brazing are as follows:

1. The filler material should be an alloy of lead (Pb) and tin (Sn). This filler material is generally known as the solder.
2. The soldering material or the solder is melted, and it is used in liquid phase while joining process. This liquid solder seeps inside the joint through the capillary action.
3. The flux material used in soldering process is either Zinc chloride (zncl₂) or Ammonium chloride (NH₄Cl).
4. When it comes to the comparison of strengths, the strength of soldering is less as compared to the strength of brazing.
5. The soldering joining process finds its application in fabrication of electrical and electronic circuits.

Brazing: Brazing is a joining method which is used to join similar or dissimilar metals with the help of some filler material. The liquidus temperature of this filler material should be more than 427^o Celsius, but it is limited by solidus temperature of base metal. The features which make the brazing process different from soldering process are as follows:

1. The filler material should be an alloy of copper (Cu) and Zinc (Zn). This filler material is generally known as the filler material for brazing. This alloy of copper and zinc is known as brass.
2. The brazing material or the brass is melted, and it is used in liquid phase while joining process. This liquid brass seeps inside the joint through the capillary action.
3. The flux material used in brazing process is borax.
4. When it comes to the comparison of strengths, the strength of soldering is less as compared to the strength of brazing. The braze joint has more strength.
5. The brazing joint is used in producing leak proof joint in hydraulic circuits and pipe joining processes.