Multi-Chip Module

(IEM), which produces high-grade electronic modules used by several major electronics manufacturers to produce a variety of military and commercial telecommunications devices such as aircraft radios, navigational equipment, land-based satellite receivers, and other items. IEM has 60 employees. Normally, IEM purchases electronic parts such as resistors, capacitors, circuit boards and enclosures from several different suppliers and assembles the modules in its own facility. Some of the parts, like

Generally the CPU has fetch, decode, and execute operation. Most of today’s multi-core processors feature shared caches. In shared caches the caches are splitted into blocks and are used randomly by each core in a multi-core processor. Because of this there is severe delay experienced by each core and the processing speed is also reduced. This happens due to more time taken for read operation of memory and CPU. The problem faced by such architectures is cache contention. So far the time required

Microcontroller and Sensors Based Gesture Vocalizer Abstract: - Gesture Vocalizer is a large scale multi-microcontroller based system being designed to facilitate the Communication among the dumb, deaf and blind communities and their communication with the normal people. This system can be dynamically reconfigured to work as a “smart device”. In this paper, microcontroller and sensors based gesture vocalizer is presented. Gesture vocalizer discussed is basically a data glove and a microcontroller

they could be near and dear organizers or they could be silly time-misusing traps. Applications make advanced cells more like minimal PCs, which is definitely what they are. The depiction of a front line advanced cell sounds just like a PC, with multi-focus processors, gigabytes of memory, and a veritable working structure. In this way, an advanced mobile phone is a gadget that carries on from various perspectives like an adaptable PC that is always connected to the web and a

High Voltage 3-D Power Module Atanu Dutta, Simon Ang, and Zhong Chen Department of Electrical Engineering, University of Arkansas, Fayetteville, AR, USA Abstract—In this paper, a low temperature co-fired ceramic (LTCC) interposer based high voltage (13 kV) half-bridge power module is proposed. The proposed power module utilized multi-layer LTCC interposers to perform 3-D stack, which provides series connection between devices to achieve high voltage rating of the power module. The proposed 3-D stack

containing photodiode receive signals from light sources. In few cases, digital camera may also be sufficient. The sensors used for receiving signals are infact an array of photodiodes(pixels), where each one can be used as separate channel to provide multi-channel propagation. PLC- Power Line Communication is also like VLC, developed in the same era and is the method of transmitting data on transmission lines meant for electric power distribution to comsumers.The basic principle involved in PLC is that

Mainframes are virtualization; it can run multiple operating system and application. A mainframe can handle multi-user operations responding according to the user’s request. Mainframes are popular for it security and reliability, an ordinary virus hardly affect a mainframe. a non-authorized user are unable to access the mainframe until the user is a granted permission

DESIGN AND IMPLEMENTATION OF A MULTI-AGENT INTELLIGENT ELECTROMECHANICAL SYSTEM (MIEMS) FINAL YEAR PROJECT REPORT SUBMITTED BY: MAHMOOD AZHAR QURESHI 2009-NUST-BE-ELEC-102 JAHANZAIB SOHAIL 2009-NUST-BE-ELEC-101 GHINA ZIA 2009-NUST-BE-ELEC-085 ZAIN IMRAN 2009-NUST-BE-ELEC-097 PROJECT SUPERVISOR: Dr. Muhammad Salman Dr. Shoab Ahmad Khan BACHELORS IN ELECTRICAL ENGINEERING NUST COLLEGE OF ELECTRICAL & MECHANICAL ENGINEERING DECLARATION We hereby declare that no portion

This figure is due to the inefficiency of power amplifiers. It also affects the performance of the device too. These chips in the smartphone wastes 65 percent of their energy due to their inefficiency [11]. Now a startup which is spinout from MIT, ETA devices say that they have found the design for high efficiency. If the design works out properly then it would slash half

world's largest and most valuable semiconductor chip makers. Intel chipsets also the motherboard, network interface controllers and integrated circuits, flash memory, graphic chips, embedded processors and other devices related to communications and computing it. Semiconductor pioneers Robert Noyce and Gordon Moore established it on July 18, 1968, and widely associated with the executive leadership and vision of Andrew Grove, Intel's advanced chip design capability with a leading-edge manufacturing