Choose the correct answer. A material that has high bond energy and high bond stiffness is expected to have: high Young’s modulus, high melting point, and low coefficient of thermal expansion high Young’s modulus, low melting point, and high coefficient of thermal expansion high Young’s modulus, high melting point, and high coefficient of thermal expansion low Young’s modulus, low melting point, and high coefficient of thermal expansion  High tensile strength of a material is usually associated with its: high electrical conductivity high magnetic permeability high hardness none of the above          If a material exhibits a predominantly covalent bonding then the material is expected to have: high hardness high stiffness high melting point all of the above

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
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Choose the correct answer.

A material that has high bond energy and high bond stiffness is expected to have:

  • high Young’s modulus, high melting point, and low coefficient of thermal expansion
  • high Young’s modulus, low melting point, and high coefficient of thermal expansion
  • high Young’s modulus, high melting point, and high coefficient of thermal expansion
  • low Young’s modulus, low melting point, and high coefficient of thermal expansion 

High tensile strength of a material is usually associated with its:

  • high electrical conductivity
  • high magnetic permeability
  • high hardness
  • none of the above

        

If a material exhibits a predominantly covalent bonding then the material is expected to have:

  • high hardness
  • high stiffness
  • high melting point
  • all of the above           

                                                                                           

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