In the hanger shown the upper portion of link ABC is 9-mm thick and the lower portions are each 6-mm thick. Epoxy resin is used to bond the upper and lower portions together at B. The pin at A is of 9-mm diameter while a 6-mm-diameter pin is used at C. Determine (a) the shearing stress in pin A. (b) the shearing stress in pin C. (e) the largest normal stress in link ABC, (d) the average shearing stress on the bonded surfaces at B, (e) the bearing stress in the link at C. 30 mm 150 mm 40 mm 170 mm 240 mm 2400 N 120 m

Elements Of Electromagnetics
7th Edition
ISBN:9780190698614
Author:Sadiku, Matthew N. O.
Publisher:Sadiku, Matthew N. O.
ChapterMA: Math Assessment
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In the hanger shown the upper portion of link ABC is 9-mm thick and the lower
portions are each 6-mm thick. Epoxy resin is used to bond the upper and lower
portions together at B. The pin at A is of 9-mm diameter while a 6-mm-diameter
pin is used at C. Determine (a) the shearing stress in pin A. (b) the shearing stress
in pin C, (c) the largest normal stress in link ABC, (d) the average shearing stress on
the bonded surfaces at B, (e) the bearing stress in the link at C.
30 mm
150 mm
40 mm
170 mm
240 mm
2400 N
120 m
Transcribed Image Text:In the hanger shown the upper portion of link ABC is 9-mm thick and the lower portions are each 6-mm thick. Epoxy resin is used to bond the upper and lower portions together at B. The pin at A is of 9-mm diameter while a 6-mm-diameter pin is used at C. Determine (a) the shearing stress in pin A. (b) the shearing stress in pin C, (c) the largest normal stress in link ABC, (d) the average shearing stress on the bonded surfaces at B, (e) the bearing stress in the link at C. 30 mm 150 mm 40 mm 170 mm 240 mm 2400 N 120 m
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