preview

Hybrid Electronics Essay

Good Essays

Flexible Hybrid Electronics (FHE) are the new generation of electronics combining flexible plastic film substrates with electronic devices. Besides the electrical features, design improvements of FHEs depend on the prediction of mechanical and failure behavior. Debonding of electronic components from the flexible substrate is one of the most common and critical failures of these components, therefore, experimental determination of material and interface properties is of great importance in the prediction of failure mechanisms. Traditional interface characterization involves isolated shear and normal mode tests such as the double cantilever beam (DCB) and end notch flexure (ENF) tests. Howverer, due to the thin, flexible nature of the …show more content…

Flexible electronics overcome the brittle rigid character of the classic electronics. Due to flexible and thin nature of Flexible Electronics mechanical behavior of these elements play a key role to fulfill the electrical capacities, however the range of application of these devices are extremely abroad as well as the materials, moreover the flexibility of FHEs lead to various mechanical deformation modes. Therefore, the FHEs should be capable of withstanding deformation and maintain the electrical performances at the same time. To evaluate the durability of these devices under different loading configuration a good estimation of the failure criteria should be obtained. Interfacial failure in hybrid flexible structures are the most common and critical failures in flexible Electronics. Owing to different in materials and layer thicknesses, generally the interfacial fractures occurred under Mixed-mode conditions (Many Ref.). Substantial researches have been conducted to measure the Mixed mode fracture parameters. Beside the experimental parts, numerical models have been implemented to analyze the correlation between the Mixed mode and interfacial fracture toughness. The first model based on Linear Elastic Fracture Mechanics (LEFM) which explained the interface crack of dissimilar materials was first established in 1959 (9). The model was improved in 1968 by Dudurs and bogy who described the surface

Get Access