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11. In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): Wafer Solution 1 Solution 2 1 9.9 10.2 2 9.4 10.6 3 9.3 10.7 4 9.6 10.4 5 10.2 10.5 6 10.6 10.0 7 10.3 10.2 8 10.0 10.7 9 10.3 10.4 10 10.1 10.3 Do the data support the claim that the mean etch rate of solution 1 exceeds that of solution 2? In reaching your conclusions, use a-0.05.

11. In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): Wafer Solution 1 Solution 2 1 9.9 10.2 2 9.4 10.6 3 9.3 10.7 4 9.6 10.4 5 10.2 10.5 6 10.6 10.0 7 10.3 10.2 8 10.0 10.7 9 10.3 10.4 10 10.1 10.3 Do the data support the claim that the mean etch rate of solution 1 exceeds that of solution 2? In reaching your conclusions, use a-0.05.

MATLAB: An Introduction with Applications
MATLAB: An Introduction with Applications
6th Edition
ISBN:9781119256830
Author:Amos Gilat
Publisher:Amos Gilat
Chapter1: Starting With Matlab
Section: Chapter Questions
Problem 1P
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Answer the following picture below with this step. Step 1: State the null and alternative hypotheses. Step 2: State the significant level (α) and sample statistics. Step 3: Compute the test statistics, the confidence interval and the P-value. Step 4: Determine the critical region and the plot of H0 against the confidence interval. Step 5: State the conclusion.
11. In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): Wafer Solution 1 Solution 2 1 9.9 10.2 2 3 9.4 9.3 10.6 10.7 4 9.6 10.4 5 6 7 10.2 10.6 10.3 10.5 10.0 10.2 8 10.0 10.7 9 10.3 10.4 10 10.1 10.3 Do the data support the claim that the mean etch rate of solution 1 exceeds that of solution 2? In reaching your conclusions, use a-0.05.
Transcribed Image Text:11. In semiconductor manufacturing, wet chemical etching is often used to remove silicon from the backs of wafers prior to metalization. The etch rate is an important characteristic in this process and known to follow a normal distribution. Two different etching solutions have been compared, using two random samples of 10 wafers for each solution. The observed etch rates are as follows (in mils per minute): Wafer Solution 1 Solution 2 1 9.9 10.2 2 3 9.4 9.3 10.6 10.7 4 9.6 10.4 5 6 7 10.2 10.6 10.3 10.5 10.0 10.2 8 10.0 10.7 9 10.3 10.4 10 10.1 10.3 Do the data support the claim that the mean etch rate of solution 1 exceeds that of solution 2? In reaching your conclusions, use a-0.05.
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