A 20 mm * 20 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated starting length of 20 mm that acts as turbulator. Airflow at 25°C (1 atm) with a velocity of 25 m/s is used to cool the upper surface of the chip. If the maximum surface temperature of the chip cannot exceed 75°C, determine the maximum allowable power dissipation on the chip surface.

A 20 mm * 20 mm silicon chip is mounted such that the edges are flush in a substrate. The substrate provides an unheated starting length of 20 mm that acts as turbulator. Airflow at 25°C (1 atm) with a velocity of 25 m/s is used to cool the upper surface of the chip. If the maximum surface temperature of the chip cannot exceed 75°C, determine the maximum allowable power dissipation on the chip surface.

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter7: Forced Convection Inside Tubes And Ducts

Section: Chapter Questions

Problem 7.16P

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