A silicon wafer is oxidized in dry O2 at 1100 oC for 1 hour. (a) What is the thickness of the oxide grown? (b) How much additional time is required to grow 0.6 μm more oxide in wet O2 at 1200 oC?
A silicon wafer is oxidized in dry O2 at 1100 oC for 1 hour. (a) What is the thickness of the oxide grown? (b) How much additional time is required to grow 0.6 μm more oxide in wet O2 at 1200 oC?
University Physics Volume 3
17th Edition
ISBN:9781938168185
Author:William Moebs, Jeff Sanny
Publisher:William Moebs, Jeff Sanny
Chapter9: Condensed Matter Physics
Section: Chapter Questions
Problem 56P: The measured density of a KCl crystal is 1.984 g/cm3. What is the equilibrium separation distance of...
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A silicon wafer is oxidized in dry O2 at 1100 oC for 1 hour.
(a) What is the thickness of the oxide grown?
(b) How much additional time is required to grow 0.6 μm more oxide in wet O2 at 1200 oC?
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