- At Powder Pressing of ceramic, the function of binder is ….. * a- decreasing of porosities. b- lubrication of particles. 37- Ceramic substrates that are used for integrated circuits and layered capacitors are manufactured by ……. * b- tape casting. a
- At Powder Pressing of ceramic, the function of binder is ….. * a- decreasing of porosities. b- lubrication of particles. 37- Ceramic substrates that are used for integrated circuits and layered capacitors are manufactured by ……. * b- tape casting. a
Chapter34: Miscellaneous Separation Methods
Section: Chapter Questions
Problem 34.14QAP
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Question
36- At Powder Pressing of ceramic, the function of binder is ….. *
a- decreasing of porosities.
b- lubrication of particles.
37- Ceramic substrates that are used for integrated circuits and layered capacitors are manufactured by ……. *
b- tape casting.
a- rolling.
38- Material which has no fixed solidification temperature, is considered as…. *
a- crystalline.
b- glass.
39- Refractories that are rich in magnesia (MgO) are termed…… *
a- Acidic.
b- Basic.
40- The function of Feldspar is …… *
a- filler.
b- flux.
c- plastic material.
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