Forced air at Too = 25°C and V = 17 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm x 4 mm, located 129 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nuz = 0.04RE0.85 Pr3 V, T Chip Board L mm Estimate the surface temperature of the chip if it is dissipating 38 mW.

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Chapter7: Forced Convection Inside Tubes And Ducts
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Forced air at T0 = 25°C and V = 17 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm x 4 mm, located 129 mm from the leading edge of
the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form
Nuz = 0.04RE0.85 Pr3
V, T.
Chip
Board
L
mm
Estimate the surface temperature of the chip if it is dissipating 38 mW.
Transcribed Image Text:Forced air at T0 = 25°C and V = 17 m/s is used to cool electronic elements on a circuit board. One such element is a chip, 4 mm x 4 mm, located 129 mm from the leading edge of the board. Experiments have revealed that flow over the board is disturbed by the elements and that convection heat transfer is correlated by an expression of the form Nuz = 0.04RE0.85 Pr3 V, T. Chip Board L mm Estimate the surface temperature of the chip if it is dissipating 38 mW.
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