Show the process of copper electroless plating on iron rod using EDTA stabilized copper sulphate and formaldehyde as reducing agent is a apontaneous process. (E^0 Cu/Cu^2+ = +0.216V, E^0 OH-/H2O = -1.14V %3D

Show the process of copper electroless plating on iron rod using EDTA stabilized copper sulphate and formaldehyde as reducing agent is a apontaneous process. (E^0 Cu/Cu^2+ = +0.216V, E^0 OH-/H2O = -1.14V %3D

Principles of Modern Chemistry

8th Edition

ISBN:9781305079113

Author:David W. Oxtoby, H. Pat Gillis, Laurie J. Butler

Publisher:David W. Oxtoby, H. Pat Gillis, Laurie J. Butler

Chapter22: Inorganic Materials

Section: Chapter Questions

Problem 26P

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Question

Show the process of copper electroless
plating on iron rod using EDTA stabilized
copper sulphate and formaldehyde as
reducing agent is a apontaneous process.
(E^0 Cu/Cu^2+ = +0.216V, E^O OH-/H2O =
-1.14V

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