When a p-and n-type semiconductor are joined at an interface their Fermi energies equilibriate. If we extend this thinking and apply it to an interface between a metal and (p-or n-type) semiconductor to make a metal-semiconductor heterojunction, what will the expected outcome be? Use diagrams and words to explain.

When a p-and n-type semiconductor are joined at an interface their Fermi energies equilibriate. If we extend this thinking and apply it to an interface between a metal and (p-or n-type) semiconductor to make a metal-semiconductor heterojunction, what will the expected outcome be? Use diagrams and words to explain.

Power System Analysis and Design (MindTap Course List)

6th Edition

ISBN:9781305632134

Author:J. Duncan Glover, Thomas Overbye, Mulukutla S. Sarma

Publisher:J. Duncan Glover, Thomas Overbye, Mulukutla S. Sarma

Chapter4: Transmission Line Parameters

Section: Chapter Questions

Problem 4.2P: The temperature dependence of resistance is also quantified by the relation R2=R1[ 1+(T2T1) ] where...

See similar textbooks

Similar questions

Take a diode formed by the junction of two type n and p semiconductors. In the figure below is the diagram of the energy bands of these semiconductors, (remember the concept of fermi energy, and knowing that for a pure semiconductor it is in the middle). Based on the figures below, answer a) What is the possible current direction in the direction from p to n or from n to p? b) Explain why the current flow occurs only in one direction.
A. Why does the conductivity of a semiconductor and some insulators change with impurity content? Compare this with the behaviour of metallic conductors. B. Discuss the location of the Fermi levels of intrinsic and extrinsic (n-type and p-type) semiconductors in low temperature and high temperature ranges. C. Discuss why the structure of the p-n junction is so important to modern technologies that impact our daily life.
a) With the aid of illustrations and using Silicon, describe what an intrinsic semiconductor material is. (b) With the aid of illustrations and using Silicon, describe what an extrinsic N type semiconductor material is. (c) With the aid of illustrations and using Silicon, describe what an extrinsic P type semiconductor material is. (d) With the aid of illustrations, describe what happens when P and N materials are joined/fused together and what is formed across the join. Then describe and illustrate how the formation at the junction can be controlled. (e) Give clear illustrations of characteristics for GERMANIUM and SILICON DIODES and say what is the threshold value (Vt) for Silicon and Germanium.
For intrinsic semiconductors, the concentration of intrinsic carriers ni depends on the temperature of theas follows:Thus, a graph of (ln ni) as a function of 1 / T (K) –1 must be linear and have a slope of (-Ee / 2k). Explain,succinctly, the reason for the presence of factor 2 in the denominator of Equation 1.
Elaborate the following with Scientific Reason a. Why Intrinsic Semiconductor materials are the bad conductors of electricity? Elaborate the process to make them full conductors b. Elaborate the concept and importance of Majority Carriers and Minority Carriers inside P-N Junction c. Elaborate why Depletion Zone inside P-N Junction is a problematic area? What necessary measurement should be taken to remove the depletion zone?
Figure Q4 shows the silicon wafer. This silicon has been added with the two elements as listed in Table Q3. Identify the majority charge carrier in each extrinsic silicon wafer and justify your answer with illustrations.
What is band bending, and why does it happen when two dissimilar materials (for example, p-type and n-type semiconductors; metal and semiconductor) come into contact?
The linear electron and hole concentration profiles in a 4 um wide region of silicon material is shown in the figure below. The silicon material is subjected to electron injection from the left and hole injection from the right as shown in the figure. Assume that the cross-sectional area of the material ?=1 ??2, electron mobility ??=1312.75 ??2/? ?, and hole mobility ??=463.33 ??2/? ?. Find the total current (to one decimal place) flowing through the material. ?=300?, ?=1.6×10−19 ?, ?=8.62×10−5 ??/?, ?=1.38×10−23 ?/?, and 1 ??=1.6×10−19 ?. Explain how depletion and diffusion capacitances differ
Using constant-voltage diode model, where VDO = 0.5 V, plot vo versus vi. Make sure to show all steps, initial plots with dashed lines, final plot, amplitudes, slopes, intersection with axis, etc.
Draw and label separate energy-band diagrams representing n-type silicon, p-type silicon at room temperature. Use these diagrams to explain what is meant by donors, acceptors, ionization energy and free carriers.
What is the difference between the manufacturing process a Schottky barrier and a Ohmic contact? Does the metal and semiconductor simply make these junctions as free electrons move (meaning if a metal and semiconductor were joined, would they just make the diode or is there a special mending process that produces the diodes)? ..
Discuss the significance of Moore's Law in the context of microchips and semiconductor technology. How has the continuous scaling of microchips influenced their performance and energy efficiency over time?