DAT 475 Module Three Project One_Miguel_Ortiz_Paonessa

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Southern New Hampshire University *

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Industrial Engineering

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Apr 3, 2024

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docx

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1 Miguel Ortiz Paonessa DAT 475 Module Three: Project One Instructor: Lee E. Edwards, MS Sunday, January 28, 2024

2 In Tijuana, Mexico, a manufacturing company specializing in electronic boards is grappling with quality challenges amidst rising product demand. Their production process, consisting of component placement, wave soldering, and thorough quality inspections, has been blemished by an increase in various welding defects. These defects, ranging from solder bridges to component misalignments, have significantly impacted the post-assembly quality of the boards. To adhere to the stringent IPC-A-610E quality standards and address the escalating cost concerns of post-production corrections, the company is compelled to tackle these defects head- on. The company's strategic response involves two key objectives: achieving a 20% reduction in welding defects and enhancing the capacity of their production lines by 20% without exacerbating the defect rates. This dual approach underscores the imperative to not only enhance production efficiency but also to ensure the consistent quality of the electronic boards. The resolution of these manufacturing issues is critical for the company to meet its quality standards and maintain its operational efficiency in the face of increasing demand. I will provide 2 key findings. The first findings will be done through Pareto Chart Insights : The analysis will reveal that specific defects, including component misalignment, billboarding, and bad modules, dominate the defect spectrum. These defects are critical focal points for improvement strategies. The second key finding will be set as Root Cause Analysis : A fishbone diagram pinpointing potential causes across six domains: Materials, Methods, Machines, Manpower, Measurement, and Environmental Factors . Each domain offers insight into underlying issues and guides targeted improvement measures.

3 Figure 1: Pareto Chart - Number of Defects based on Defect Types - Model 595310-001-00 The dominant defect on this chart is 'Excessive Solder', followed by 'Solder Bridge', and 'Damaged Component'. These top three defects account for a substantial portion of the total, with 'Excessive Solder' alone constituting a significant percentage. This suggests that issues in solder application and component handling are critical areas for improvement in this model.

4 Figure 2: Pareto Chart - Number of Defects based on Defect Types - Model 595481-00x-00 Similar to the first chart, 'Solder Bridge' and 'Missing Component' are among the top defects, with 'Excessive Solder' again being the most frequent. The persistence of 'Excessive Solder' across models indicates a systemic problem in the soldering process.

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