Problem Description: Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process the dies are sliced apart to make individual CPUS. Your program will do some calculations about these wafers and chips. Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer. The equation does correct for wasted material near the edges. Note that it should give an integer number of dies (you don't want half a die). DPW = dn 4S V25

C++ for Engineers and Scientists
4th Edition
ISBN:9781133187844
Author:Bronson, Gary J.
Publisher:Bronson, Gary J.
Chapter1: Fundamentals Of C++ Programming
Section1.3: Preliminary Three: Software Development
Problem 3E: (Electrical eng.) You’ve been asked to write a program that outputs the following specifications:...
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Problem Description:
Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a
silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to
it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process
the dies are sliced apart to make individual CPUS. Your program will do some calculations
about these wafers and chips.
Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square
millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer.
The equation does correct for wasted material near the edges. Note that it should give an integer
number of dies (you don't want half a die).
DPW = dn
4S
V25
Where:
DPW = Die Per Wafer (the number of dies from a wafer)
d = the diameter of the wafer (mm)
S = the chip area (mm2)
Another formula you will need is the area of a circle (the wafer). Look that up and give a
reference to the URL where you found it.
Your program must generate output that matches these sample runs. That includes spelling,
spacing, blank lines and all messages.
Transcribed Image Text:Problem Description: Your programs will be running all semester on a "chip", a CPU. This chip is manufactured on a silicon wafer, a very, very thin circular slice of purified silicon with some impurities added to it. A wafer usually has many chips (or dies) created on its surface, then at one point in the process the dies are sliced apart to make individual CPUS. Your program will do some calculations about these wafers and chips. Given the diameter of the wafer in millimeters (mm) and the area of one individual die in square millimeters (mm^2), this equation will calculate how many dies can be cut from the wafer. The equation does correct for wasted material near the edges. Note that it should give an integer number of dies (you don't want half a die). DPW = dn 4S V25 Where: DPW = Die Per Wafer (the number of dies from a wafer) d = the diameter of the wafer (mm) S = the chip area (mm2) Another formula you will need is the area of a circle (the wafer). Look that up and give a reference to the URL where you found it. Your program must generate output that matches these sample runs. That includes spelling, spacing, blank lines and all messages.
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Course Technology Ptr