Tin 100 mm 50 mm 100 mm T out Figure 3 illustrates a compound wall constructed of an inner and outer layer of standard brick and a central layer of standard cavity wall insulation material. If the temperature inside is 21°C and the temperature outside -3°C, what is the rate of heat transfer through the wall per unit area? Data: take the value of the convective heat transfer coefficient for both inside and outside in (c) as 10 Wm ²K¹

Tin 100 mm 50 mm 100 mm T out Figure 3 illustrates a compound wall constructed of an inner and outer layer of standard brick and a central layer of standard cavity wall insulation material. If the temperature inside is 21°C and the temperature outside -3°C, what is the rate of heat transfer through the wall per unit area? Data: take the value of the convective heat transfer coefficient for both inside and outside in (c) as 10 Wm ²K¹

Principles of Heat Transfer (Activate Learning with these NEW titles from Engineering!)

8th Edition

ISBN:9781305387102

Author:Kreith, Frank; Manglik, Raj M.

Publisher:Kreith, Frank; Manglik, Raj M.

Chapter2: Steady Heat Conduction

Section: Chapter Questions

Problem 2.27P: Derive an expression for the temperature distribution in an infinitely long rod of uniform cross...

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1.1 On a cold winter day, the outer surface of a 0.2-m-thick concrete wall of a warehouse is exposed to temperature of –5°C, while the inner surface is kept at 20°C. The thermal conductivity of the concrete is 1.2 W/m K. Determine the heat loss through the wall, which is 10-m long and 3-m high. Problem 1.1
An electronic device that internally generates 600 mW of heat has a maximum permissible operating temperature of 70C. It is to be cooled in 25C air by attaching aluminum fins with a total surface area of 12cm2. The convection heat transfer coefficient between the fins and the air is 20W/m2K. Estimate the operating temperature when the fins are attached in such a way that (a) there is a contact resistance of approximately 50 K/W between the surface of the device and the fin array and (b) there is no contact resistance (in this case, the construction of the device is more expensive). Comment on the design options.
2.38 The addition of aluminum fins has been suggested to increase the rate of heat dissipation from one side of an electronic device 1 m wide and 1 m tall. The fins are to be rectangular in cross section, 2.5 cm long and 0.25 cm thick, as shown in the figure. There are to be 100 fins per meter. The convection heat transfer coefficient, both for the wall and the fins, is estimated to be K. With this information determine the percent increase in the rate of heat transfer of the finned wall compared to the bare wall.
2.9 In a large chemical factory, hot gases at 2273 K are cooled by a liquid at 373 K with gas-side and liquid-side convection heat transfer coefficients of 50 and , respectively. The wall that separates the gas and liquid streams is composed of a 2-cm thick oxide layer on the gas side and a 4-cm thick slab of stainless steel on the liquid side. There is a contact resistance between the oxide layer and the steel of . Determine the rate of heat loss from hot gases through the composite wall to the liquid.
3.10 A spherical shell satellite (3-m-OD, 1.25-cm-thick stainless steel walls) re-enters the atmosphere from outer space. If its original temperature is 38°C, the effective average temperature of the atmosphere is 1093°C, and the effective heat transfer coefficient is , estimate the temperature of the shell after reentry, assuming the time of reentry is 10 min and the interior of the shell is evacuated.
The handle of a ladle used for pouring molten lead is 30 cm long. Originally the handle was made of 1.9cm1.25cm mild steel bar stock. To reduce the grip temperature, it is proposed to form the handle of tubing 0.15 cm thick to the same rectangular shape. If the average heat transfer coefficient over the handle surface is 14 W/m K, estimate the reduction of the temperature at the grip in air at 21C.
2.42 A circumferential fin of rectangular cross section, 3.7-cm OD and 0.3 cm thick, surrounds a 2.5-cm- diameter tube as shown below. The fin is constructed of mild steel. Air blowing over the fin produces a heat transfer coefficient of K. If the temperatures of the base of the fin and the air are and , respectively, calculate the heat transfer rate from the fin.
The heat transfer coefficient for a gas flowing over a thin float plate 3-m long and 0.3-m wide varies with distance from the leading edge according to hc(x)=10x1/4Wm2K If the plate temperature is 170C and the gas temperature is 30C, calculate (a) the average heat transfer coefficient, (b) the rate of heat transfer between the plate and the gas, and (c) the local heat flux 2 m from the leading edge. Problem 1.18
One end of a 0.3-m-long steel rod is connected to a wall at 204C. The other end is connected to a wall that is maintained at 93C. Air is blown across the rod so that a heat transfer coefficient of 17W/m2 K is maintained over the entire surface. If the diameter of the rod is 5 cm and the temperature of the air is 38C, what is the net rate of heat loss to the air?
1.4 To measure thermal conductivity, two similar 1-cm-thick specimens are placed in the apparatus shown in the accompanying sketch. Electric current is supplied to the guard heater, and a wattmeter shows that the power dissipation is 10 W. Thermocouples attached to the warmer and to the cooler surfaces show temperatures of 322 and 300 K, respectively. Calculate the thermal conductivity of the material at the mean temperature in W/m K. Problem 1.4
3.16 A large, 2.54-cm.-thick copper plate is placed between two air streams. The heat transfer coefficient on one side is and on the other side is . If the temperature of both streams is suddenly changed from 38°C to 93°C, determine how long it takes for the copper plate to reach a temperature of 82°C.
2.7 A very thin silicon chip is bonded to a 6-mm thick aluminum substrate by a 0.02-mm thick epoxy glue. Both surfaces of this chip-aluminum system are cooled by air at , where the convective heat transfer coefficient of air flow is . If the heat dissipation per unit area from the chip is under steady-state conditions, draw the thermal circuit for the system and determine the operating temperature of the chip.