DAT475 Project One

.docx

School

Southern New Hampshire University *

*We aren’t endorsed by this school

Course

475

Subject

Mechanical Engineering

Date

Feb 20, 2024

Type

docx

Pages

12

Uploaded by ChancellorNightingale2248

Report
Southern New Hampshire University DAT 475 Applied Data Analysis Project One Case Study January 28, 2024
Preliminary Analysis Report Problem Statement A manufacturing company in Tijuana, Mexico produces electronic boards that go through a welding process in the Manual Finish area of the production line. Within this process the electronic boards have Thru-Holes components placed on the boards. The assembly of the electronic boards and Thru-Holes components is then welded in a wave soldering machine. The welded assembly is then quality checked by an employee who checks that the assembly does not have any welding defects. After quality check, the assembly is sent to other areas of the production for additional components to be installed. Recently there has been an increase in demand for products produced by the company. There has also been an uptick in the defects in the welding process of the electronic boards and Thru-Holes components. These defects include the solder bridge, missing components, damaged components, lifted components, insufficient solder, and excessive solder. This increase in defects has led to a rise in the number of assembly and electronic test problems after the electronic boards have gone through their final assembly stage (SNHU, 2023). The company is now going to comply with the requirements established by the IPC-A- 610E standard for electronic components and the products will need to be fixed before their final release. However, an assessment concluded that fixing the defects after they have gone through final assembly is cost prohibitive, time consuming, and requires staffing with specific skills. The standard IPC-A-610E criteria is not focused on processes to perform assembly operations or allow the change, modification, or repair of the final product.
In reviewing these elements, the company has requested a project to improve manufacturing defects with two outcomes. First, they would like a 20% reduction in defects generated during the welding process in three double production lines (SNHU, 2023). Second, a 20% increase in the capacity of the three double production lines where the boards are processed, while not increasing the percentage of defects (SNHU, 2023). By decreasing the manufacturing defects and expanding the capacity of the production line the company will reduce costs and improve quality of their products. This will allow the company to meet the greater demand for their products. Cause(s) of the Identified Organizational Problem The company provided defect data sets for three of their models as well as the entire facility. The data will be analyzed utilizing Pareto charts that I have created. I will use the 80/20 rule. This will allow us to determine what areas are causing the most defects. The company can then focus on the concerns where the defects fall below the 80% defect percentage. The Pareto charts help to determine what the most significant defects are. The most significant causes of defects are shown in Figures 1 thru 4 below. Model 595407-XXX-00 The Model 595407-XXX-00 issues that had 80% of defects were solder bridge, missing component, lifted component, damaged component, excessive solder, reversed component, and solder void. Component broken, pin hole, and long terminals all had zero defects. All results are shown in Figure 1 below.
Figure 1-Defects for Model 595407-XXX-00 Model 595481-00X-00 The Model 595481-00X-00 issues that had 80% of defects were solder bridge, lifted component, wrong component, pin damaged, missing component, excessive solder, and reversed component. Component misalignment, pin holes, and long terminals all had zero defects. All results are shown in Figure 2 below.
Figure 2-Defects for Model 595481-00X-00 Model 595310-001-00 The Model 595310-001-00 issues that had 80% of defects were excessive solder, solder bridge, damaged component, and pin damaged. The issues with zero defects were billboarding, trace open, component broken, and long terminals. All results are seen in Figure 3 below.
Your preview ends here
Eager to read complete document? Join bartleby learn and gain access to the full version
  • Access to all documents
  • Unlimited textbook solutions
  • 24/7 expert homework help