2A wall is constructed of 2.0 cm of copper, 3.0 mm of asbestos sheet [k = 0.166 W/m.°C], and 6.0 cm of fiberglass. Calculate the heat flow per unit area for an overall temperature difference of 500°C. 1.1: CCO:
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- 1.4 To measure thermal conductivity, two similar 1-cm-thick specimens are placed in the apparatus shown in the accompanying sketch. Electric current is supplied to the guard heater, and a wattmeter shows that the power dissipation is 10 W. Thermocouples attached to the warmer and to the cooler surfaces show temperatures of 322 and 300 K, respectively. Calculate the thermal conductivity of the material at the mean temperature in W/m K. Problem 1.41.63 Liquid oxygen (LOX) for the space shuttle is stored at 90 K prior to launch in a spherical container 4 m in diameter. To reduce the loss of oxygen, the sphere is insulated with superinsulation developed at the U.S. National Institute of Standards and Technology's Cryogenic Division; the superinsulation has an effective thermal conductivity of 0.00012 W/m K. If the outside temperature is on the average and the LOX has a heat of vaporization of 213 J/g, calculate the thickness of insulation required to keep the LOX evaporation rate below 200 g/h.Repeat Problem 1.35 but assume that instead of surface temperatures, the given temperatures are those of the air on the left and right sides of the wall and that the convection heat transfer coefficients on the left and right surfaces are 6 and 10W/m2K, respectively.
- 1.3 A furnace wall is to be constructed of brick having standard dimensions of Two kinds of material are available. One has a maximum usable temperature of 1040°C and a thermal conductivity of 1.7 W/(m K), and the other has a maximum temperature limit of 870°C and a thermal conductivity of 0.85 W/(m K). The bricks have the same cost and are laid in any manner, but we wish to design the most economical wall for a furnace with a temperature of 1040°C on the hot side and 200°C on the cold side. If the maximum amount of heat transfer permissible is 950 , determine the most economical arrangement using the available bricks.A square silicon chip 7mm7mm in size and 0.5-mm thick is mounted on a plastic substrate as shown in the sketch below. The top surface of the chip is cooled by a synthetic liquid flowing over it. Electronic circuits on the bottom of the chip generate heat at a rate of 5 W that must be transferred through the chip. Estimate the steady-state temperature difference between the front and back surfaces of the chip. The thermal conductivity of silicon is 150 W/m K. Problem 1.6Thermal Conductivity of Skin" Design experiments and calculate heat transfer coefficients/thermal conductivity (k)
- Example 6: Calculate the critical radius of insulation for asbestos [k = 0.17 W/m · ◦C] surrounding a pipe and exposed to room air at 20◦C with h = 3.0 W/m2 · ◦C. Calculate the heat loss from a 200◦C, .5cm-diameter pipe when covered with the critical radius of insulation and without insulation.A 1 in. o.d. (outer diameter) tube reactor is insulated with a 3 inch layer of asbestos. If the temperature of the outer surface of the insulation is 100 °F and the rate of heat loss per foot of reactor length is 50 BTU/hr, what must the temperature of the inside of the reactor be? [for asbestos, k = 0.105 BTU/hr ft °F]You are designing a small heatsink to cool a high-powered IC on a control unit PCB. The IC puts out 40,000 W/m2 and has a size of 40mm x 20mm. A fan blows 40 degrees C air across the IC at a speed of 4 m/s. The IC is well insulated on its back face. If the convection coefficient is 62 W/m2K, what is the surface temperature of the IC?
- Q2: A: The exterior wall of a single-story office building near Chicago is 3 m high and 15 m long. The wall consists of 100-mm face brick, 40-mm polystyrene insulating board. 150-mm lightweight concrete block, and an interior 16-mm gypsum. The wall contains three single-glass of 3 mm thickness windows 1.5 m high by 2 m long. Calculate the heat loss through the wall at design conditions if the inside temperature is (20 °C). The outside temperature is (-18 "C).You are designing a PCB laid horizontally on the ground. The PCB surface temperature can’t exceed 85℃ and has a size of 96mm x 90mm. Tinfinity = 45oC. "p" is the perimeter of the plate a) Calculate the Rayleigh number. b) If the PCB is laid hot-side UP, what is the Nusselt number and heat transfer coefficient? c) If the PCB is laid hot-side DOWN, what is the Nusselt number and heat transfer coefficient? d) Given your results from b and c, which one has better heat transfer? In that case, what is the maximum power dissipation the board can put out? Properties of Air:k = 0.025 W/mkPr = 0.72v = 1.847 x 10−5u = 16.84 x10−6p = 1.2 kg/m3B =1/ Tf (idwal gass)Required info: There is a 2.00 cm thick stagnant air pocket. a) What thickness of cork would have the same R-factor as the stagnant air pocket? The thermal conductivity of air is 0.0230 W/m-K and of cork is 0.0460 W/m-K. b) What thickness of tin would be required for the same R-factor as a 2.00-cm-thick stagnant air pocket? The thermal conductivity of air is 0.0230 W/m:K and of tin is 66.8 W/m-K. THANK U