Semiconductors

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    relaxation barrier depends on both single-ion anisotropy and 3d-4f magnetic exchange interactions.10 Thus when the 3d-4f magnetic exchange coupling is strong enough, the exchange coupled levels are well separated (avoiding mixing of low-lying excited states in the ground state) and the QTM is suppressed, so that large energy barriers, hysteresis loops and relaxation times are observed. It should be noted that only a few heterometallic 3d/4f complexes where the magnetic exchange interaction is able

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    Flexible nanodielectric materials with a high dielectric constant and low dielectric loss have immense potential applications in the modern electronic and electric industry. The use of high aspect ratio fillers is a promising route for achieving high dielectric constant and low loss materials at a low filler volume fraction. However, the poor filler/matrix interfacial adhesion always imposes difficulties in suppressing the dielectric loss of the composites, thus significantly limiting the potential

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    8 We systematically demonstrate that one-dimensional phononic crystal (1-D PnC) tethers can signif- 9 icantly reduce tether loss in micromechanical resonators to a point where the total energy loss is 10 dominated by intrinsic mechanisms, particularly phonon damping. Multiple silicon resonators are 11 designed, fabricated, and tested to provide comparisons in terms of the number of periods in the 12 PnC and the resonance frequency, as well as a comparison with conventional straight-beam tethers.

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    results in the expansion of business. The relocation office is in Krystal Point, Penang. A great success happened in 2007 when this company successfully develops and launches Amoeba 1340. The usage of this product is to test wireless for SMU and RF semiconductor devices located in the mobile phone such as smart phones and cell

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    Background U.S. Semiconductor, a semiconductor manufacturer decided to expand their business to UK market in 1980. Their new business plan needed specialized technical support facility in UK. In order to minimize the equity investment, they decided to fund their assets mostly with debt. As Semiconductor owned subsidiaries, which spread all over the world, they face great exchange risk. Besides, instead of building a production department in UK, Semiconductor kept producing their products domestically

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    or a semiconductor or a semi-metal depending its indexes. Carbon nanotube is actually cylindrical form of graphene sheet. By using tight binding model(TB), I got electronic band structure of graphene which was the basis for the Monte Carlo Simulation as it is superior then Boltzmann transport equation(BTE) for analyzing band structure. I have decent command on MathLab programming language. I acquired A+ grade in my thesis and not only in the thesis but also I got good grade in all semiconductor related

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    There is an impressive argument to made by some critics that the semiconductor industry considers the contamination free production process of its state of the art semiconductor wafers, paramount to that of the future health and safety concerns of its labor force. Does this argument stand? Does there in fact exist a hostile environment for the industries microchip production workers and could it play a secondary role to the concepts of innovation and profits? Could the handling of known toxic materials

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    The Semiconductor Integrated Circuits Layout Design Act 2000 provides for protection of Semiconductor Integrated Circuits Layout Design and for matters connected therewith or incidental thereto. Government of India has established Semiconductor Integrated Circuits Layout Design Registry (SICLDR) as the office for filings of application for Semiconductor IC Layout Design Registration. 1. What is the aim of the Semiconductor Integrated Circuits Layout-Design (SICLD) Act, 2000? The aim of the Semiconductor

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    Ti/Al/Re/Au are compared with respect to their contact resistance, root mean square values of surface roughness, annealing temperature and the mechanism of ohmic contact formation. Introduction: Gallium nitride (GaN) is a binary III/V direct bandgap semiconductor with a bandgap of 3.4 eV commonly used in light-emitting diodes since the 1990s. GaN has a low sensitivity to ionizing radiation which makes it a suitable material for solar panels on satellites. Various military and space application also benefit

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    Photolithography Essay

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    Following exposure, a developer solution is utilized to remove regions that have (positive resist) or have not (negative resist) been exposed, leaving the desired pattern on the sample. At this point, it is possible to deposit a patterned layer of new material on top of the sample, or to etch away exposed regions of the sample. Both cases are followed by removal of remaining resist, usually through use of 1-Methyl-2-pyrrolidone (NMP) solvent. Typically, a sample will undergo multiple cycles of

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