Annealing, an important step in semiconductor materials processing, can be accomplished by rapidly heating the silicon wafer to a high temperature for a short period of time. The schematic shows a method involving the use of a hot plate operating at an elevated temperature
(a) For
(b) For gap distances of 0.2, 0.5, and 1.0 mm, determine the heat fluxes and temperature-time change as a function of the hot plate temperature for
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Introduction to Heat Transfer
- Determine the power requirement of a soldering iron in which the tip is maintained at 400C. The tip is a cylinder 3 mm in diameter and 10 mm long. The surrounding air temperature is 20C, and the average convection heat transfer coefficient over the tip is 20W/m2K. The tip is highly polished initially, giving it a very low emittance.arrow_forward1.15 A thermocouple (0.8-mm-diameter wire) used to measure the temperature of the quiescent gas in a furnace gives a reading of . It is known, however, that the rate of radiant heat flow per meter length from the hotter furnace walls to the thermocouple wire is 1.1 W/m and the convection heat transfer coefficient between the wire and the gas is K. With this information, estimate the true gas temperature. State your assumptions and indicate the equations used.arrow_forwardThree thin sheets of polished aluminum are placed parallel to each other so that the distance between them is very small compared to the size of the sheets. If one of the outer sheets is at 280C and the other outer sheet is at 60C, calculate the temperature of the intermediate sheet and the net rate of heat flow by radiation. Convection can be ignored.arrow_forward
- Principles of Heat Transfer (Activate Learning wi...Mechanical EngineeringISBN:9781305387102Author:Kreith, Frank; Manglik, Raj M.Publisher:Cengage Learning