Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133559897
Author: KALPAKJIAN
Publisher: PEARSON
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Chapter 28, Problem 37SDP
Inspect various electronic and computer equipment, take them apart as much as you can, and identify components that may have been manufactured by the techniques described in this chapter.
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Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- Explain the role of rapid prototyping techniques such as 3D printing, CNC machining, and laser cutting in transforming digital designs into physical prototypes.arrow_forwardExplain different fabrication techniques (with figures) of microneedles. Discuss the advantages and disadvantages of microneedles. Factors affecting their performance. (Write about the mechanical properties)arrow_forwardExplore the concept of 3D printing, its applications across various industries, and the technologies involved in creating 3D printed objects.arrow_forward
- Analyze the technologies behind 3D printing and its applications in industries like healthcare, aerospace, and automotive manufacturing.arrow_forwardDefine what a microchip is and provide examples of its applications in various fields.arrow_forwardA paper clip is made of wire 0.7 mm in diameter. If the original material from which thewire is made is a rod 25 mm in diameter, calculate the longitudinal engineering and truestrains that the wire has undergone during processing.arrow_forward
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What is Rapid Prototyping?; Author: Formlabs;https://www.youtube.com/watch?v=-TDn25K-Jh4;License: Standard youtube license