Manufacturing Engineering & Technology
7th Edition
ISBN: 9780133559897
Author: KALPAKJIAN
Publisher: PEARSON
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Textbook Question
Chapter 28, Problem 6RQ
What are the purposes of prebaking and postbaking in lithography?
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In the context of 3D printing, what is Fused Deposition Modeling (FDM), and how does it differ from Stereolithography (SLA)?
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Chapter 28 Solutions
Manufacturing Engineering & Technology
Ch. 28 - Define the terms wafer, chip, die, device,...Ch. 28 - Why is silicon the semiconductor most used in...Ch. 28 - What do the abbreviations BJT, MOSFET, VLSI,...Ch. 28 - Prob. 4RQCh. 28 - Prob. 5RQCh. 28 - What are the purposes of prebaking and...Ch. 28 - Define selectivity and isotropy, and their...Ch. 28 - Prob. 8RQCh. 28 - Prob. 9RQCh. 28 - What are the levels of interconnection?
Ch. 28 - Which is cleaner, a Class-10 or a Class-1 clean...Ch. 28 - Prob. 12RQCh. 28 - What is a via? Why is it important?Ch. 28 - Describe how electrical connections are...Ch. 28 - Prob. 15RQCh. 28 - Prob. 16RQCh. 28 - Comment on your observations regarding the...Ch. 28 - Describe how n-type and p-type dopants differ.Ch. 28 - Prob. 19QLPCh. 28 - How is epitaxy different from other techniques...Ch. 28 - Note that, in a horizontal epitaxial reactor...Ch. 28 - The table that follows describes three...Ch. 28 - Prob. 23QLPCh. 28 - What is accelerated life testing? Why is it...Ch. 28 - Explain the difference between a die, a chip, anda...Ch. 28 - A common problem in ion implantation is...Ch. 28 - Examine the hole profiles shown in Fig. P28.27...Ch. 28 - Referring to Fig. 28.24, sketch the shape of the...Ch. 28 - Prob. 29QTPCh. 28 - Prob. 30QTPCh. 28 - Prob. 31QTPCh. 28 - A certain design rule calls for metal lines to be...Ch. 28 - Prob. 33QTPCh. 28 - If a square mask of side length 100 m is placed on...Ch. 28 - Obtain an expression for the width of the trench...Ch. 28 - Prob. 36SDPCh. 28 - Inspect various electronic and computer equipment,...Ch. 28 - Describe your understanding of the important...Ch. 28 - Make a survey of the necessity for clean rooms in...Ch. 28 - Prob. 40SDPCh. 28 - Prob. 41SDPCh. 28 - Estimate the time required to etch a spur gear...Ch. 28 - Prob. 43SDPCh. 28 - Review the specific devices, shown in Fig. V.2....
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- In the context of 3D printing, elaborate on the differences between Fused Deposition Modeling (FDM) and Stereolithography (SLA) printing processes. How do they work, and what are their applications?arrow_forwardHow does microchip design differ from microchip fabrication, and what tools and software are commonly used in microchip design?arrow_forwardWhy does shrinkage occur in 3D FDM printing? Explain 2 approaches to reduce shrinkage for a given component geometryarrow_forward
- please explain FDM, M,J MJF, SLS (3D plastic printing technology) working principlearrow_forwardDiscuss the various types of 3D printing technologies, such as Fused Deposition Modeling (FDM), Stereolithography (SLA), and Selective Laser Sintering (SLS). Highlight their differences and applications.arrow_forwardExplain why G-Codes (CNC programs) are used to control and fabricate the parts for the material extrusion, binder jetting and material jetting systems such as Fused Deposition Modelling (FDM); however, the G-codes are not required in the print files for the vat polymerization and powder bed fusion systems, such SLA, SLS, SLM, EBM and DLP.arrow_forward
- Describe the process of microchip manufacturing, including the use of photolithography and semiconductor materials.arrow_forwardExplain the principles of thermal transfer printing and its applications in barcode label printing.arrow_forwardExplore the concept of 4D printing and its potential applications in various industries.arrow_forward
- For optimal printing results, which type of printer is most dependent on the grade of the paper it employs?arrow_forwardIn the context of 3D printing, elucidate the various additive manufacturing techniques and their applications.arrow_forwardWhat is the Significance of the study of Fuse 3d printing Using Pet bottles in the Environmentarrow_forward
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