OPERATION MANAGEMENT
OPERATION MANAGEMENT
2nd Edition
ISBN: 9781260242423
Author: CACHON
Publisher: MCG
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Chapter 7, Problem 7PA

a)

Summary Introduction

To determine: The process capacity in units per hour with a batch size of 100 wafers.

b)

Summary Introduction

To determine: The utilization of depositing.

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JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, HP, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. Etching: Etching removes selected material from the chip surface to create the device structures. The following table lists the required processing times and setup times at each of the steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later stage. Note: A setup can only begin once the batch has arrived at the…
JCL Inc. is a major chip manufacturing firm that sells its products to computer manufacturers like Dell, Gateway, and others. In simplified terms, chip making at JCL Inc. involves three basic operations: depositing, patterning, and etching. • Depositing: Using chemical vapor deposition (CVD) technology, an insulating material is deposited on the wafer surface, forming a thin layer of solid material on the chip. Patterning: Photolithography projects a microscopic circuit pattern on the wafer surface, which has a light-sensitive chemical like the emulsion on photographic film. It is repeated many times as each layer of the chip is built. • Etching: Etching removes selected material from the chip surface to create the device structures. The table below lists the required processing times and setup times at each of the steps. There is unlimited space for buffer inventory between these steps. Assume that the unit of production is a wafer, from which individual chips are cut at a later…
Quasi-Tech Corporation produces specially machined parts. The parts are produced in batches in one continuous manufacturing process. Each part is custom produced and requires special engineering design activity (based on customer specifications). Once the design is completed, the equipment can be set up for batch production. Once the batch is completed, a sample is taken and inspected to see if the parts are within the tolerances allowed. Thus, the manufacturing process has four activities: engineering, setups, machining, and inspecting. Costs have been assigned to each activity using direct tracing and resource drivers as follows: Activity Expected Cost Activity Driver Activity Capacity Engineering $1,000,000 Engineering hours 5,000 hours Setups      900,000 Setups 200 setups Machining   2,000,000 Machine hours 25,000 machine hours Inspection      800,000 Inspection hours 2,500 inspection hours Quasi-Tech produces two models: Model C and Model D. The following table…
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