A vertical array of circuit boards is immersed in quiescent ambient air at T ∞ = 17 ° C . Although the components protrude from their substrates, it is reasonable, as a first approximation, to assume flat plates with uniform surface heat flux q x " . Consider boards of length and width L = W = 0.4 m and spacing S = 25 mm . If the maximum allowable board temperature is 77°C, what is the maximum allowable power dissipation per board?
A vertical array of circuit boards is immersed in quiescent ambient air at T ∞ = 17 ° C . Although the components protrude from their substrates, it is reasonable, as a first approximation, to assume flat plates with uniform surface heat flux q x " . Consider boards of length and width L = W = 0.4 m and spacing S = 25 mm . If the maximum allowable board temperature is 77°C, what is the maximum allowable power dissipation per board?
Solution Summary: The author explains the maximum allowable power dissipation per board, the spacing between the circuit board and plate, and the interpolation method.
A vertical array of circuit boards is immersed in quiescent ambient air at
T
∞
=
17
°
C
. Although the components protrude from their substrates, it is reasonable, as a first approximation, to assume flat plates with uniform surface heat flux
q
x
"
. Consider boards of length and width
L
=
W
=
0.4
m
and spacing
S
=
25
mm
. If the maximum allowable board temperature is 77°C, what is the maximum allowable power dissipation per board?
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