Fundamentals of Heat and Mass Transfer
Fundamentals of Heat and Mass Transfer
7th Edition
ISBN: 9780470501979
Author: Frank P. Incropera, David P. DeWitt, Theodore L. Bergman, Adrienne S. Lavine
Publisher: Wiley, John & Sons, Incorporated
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Chapter 7, Problem 7.44P

An array of 10 silicon chips, each of length L = 10 mm on a side, is insulated on one surface and cooled on the opposite surface by atmospheric air in parallel flow with T = 24 ° C and u = 40 m/s . When in use, the same electrical power is dissipated in each chip, maintaining a uniform heat flux over the entire cooled surface.
Chapter 7, Problem 7.44P, An array of 10 silicon chips, each of length L=10mm on a side, is insulated on one surface and
If the temperature of each chip may not exceed 80°C, what is the maximum allowable power per chip? What is the maximum allowable power if a turbulence promoter is used to trip the boundary layer at the leading edge? Would it be preferable to orient the array normal, instead of parallel, to the airflow?

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Imagine a plate 0.1 m long by 0.1 m wide at a temperature of 80 °C. Water is passed over its surface at a speed of 0.1 m/s and 40°C. Calculate the heat dissipated by the plate. Assume the following properties of water at 60 °C: k= 0.651 W/mK, Pr=3.02 y v = 0.478 x 10-6 m²/s.
Imagine a plate 1 m long by 1 m wide at a temperature of 80 °C. Water is passed over its surface at a speed of 1 m/s with a temperature of 40 °C.Calculate the heat dissipated by the plate. Assume the following properties of water at 60 °C: k=0.651 W/mK, Pr=3.02, v =0.478 x 10-6 m²/s.

Chapter 7 Solutions

Fundamentals of Heat and Mass Transfer

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